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Introduction:
High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet
Material:
PTFE + woven glass
Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50
Loss tangent (DF): 0.0030@10GHz
Copper adhesion: 12ibs / inch
Water absorption: ≤0.02%
Surface resistance: 1X1016 Ω
Volume resistivity: lXl012Ω
Thermal conductivity: 0.8 kcal / m / h ℃
Working temperature: -50 ~ + 260 ℃
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 | Layer: | 2 |
|---|---|---|---|
| Color: | Green | Min Line Space: | 4mil |
| Min Line Width: | 4mil | Copper Thickness: | 1OZ |
| Board Size: | 75*75MM | Panel: | 1 |
| Surface: | Immersion Gold | ||
| High Light: | printed circuit board design,printed circuit board pcb |
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Double Layer PCB Design Services 1.6MM Thickness Electronics High Frequency Circuit
specification:
layer: multilayer
material: FR4 High Frequency
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
Introduction:
High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters,
couplers and other passive components, Performance:low loss,
high dielectric constant and stable,can provide a small size sheet
Parameter:
| Layers | 1-16 layers | Min Board Thickness(2-layer) | 0.2mm |
| Max Board Size | 635 × 1100mm | Min Board Thickness(4-layer) | 0.6mm |
| Min Board Size | 20 × 30mm | Min Inner-layer Thickness | 0.1mm |
| Min Trace | 0.1mm | Min Annular Ring | 0.1mm |
| Min Space | 0.1mm | Min Hole Location Tolerance | ±0.075mm |
| Min Hole Size | 0.2mm | Min Hole Size Tolerance | ±0.05mm |
| Board Warp | ≤ 1° | Min Outer Dimension Tolerance | ±0.1mm |
| Solder Mask | Green, Yellow, Red, Black, Blue, White | ||
| Surface Finish | HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP | ||
| Board Material | FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic | ||
| Acceptable file | Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD | ||
| CAM software | Genesis, CAM350 | ||
