Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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RF / Microwave High Frequency Proper Electrical PCB Board 4 Layer PTFE-Based Materials

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
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High Frequency PCB

  • High Precision High Frequency PCB suppliers



High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet




PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

RF / Microwave High Frequency Proper Electrical PCB Board 4 Layer PTFE-Based Materials

China RF / Microwave High Frequency Proper Electrical PCB Board 4 Layer PTFE-Based Materials Supplier

Large Image :  RF / Microwave High Frequency Proper Electrical PCB Board 4 Layer PTFE-Based Materials

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: High Frequency Material Layer: 4
Color: / Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 2OZ
Board Size: 57*209mm Panel: 1
Surface: Electrolytic Gold
High Light:

printed circuit board design


printed circuit board pcb

RF/Microwave PTFE-based Materials High Frequency Proper Electrical PCB 4 Layer Board



High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.





Brand: XCE
Model: XCEH
Board size: 5.7*20.9cm
Cu thickness: 35UM
Material: High Frequency
Min line space&width: 5Mil


RF/Microwave PTFE-based Materials High Frequency Proper Electrical PCB 4 Layer Board
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting





Raw Material High Frequency
Layer Count 4-Layer
Board Thickness 1.2mm
Copper Thickness 35UM
Surface Finish OSP
Solder Mask grey
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 57*209mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable

Reference - our production capability for rigid PCB:
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Materials: FR4,Rogers,Taconic
Max. finished board size: 23 x 25 (580 x 900mm)
Min. drilled hole size: 3mil (0.075mm)
Min. line width: 3mil (0.075mm)
Min. line spacing: 3mil (0.075mm)
Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
Immersion Silver/gold,OSP, gold plating
Copper thickness: 0.5-7.0oZ
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1mil)
Inner packing: Vacuum packing/plastic bag
Outer packing: Standard carton packing
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
Special requirements: buried and blind Vias + controlled impedance + BGA
Profiling: Punching, routing, V-CUT, beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products



High Thermal Performance
Tg of 200 (DSC), 230°C (DMA)
Low CTE for reliability
Lead-free Compatible & Rhos Complaint
UV Blocking and AOI Fluorescence
Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat

PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Main Export Markets:

Eastern Europe
North America
Mid East/Africa
Western Europe
Central/South America

Primary Competitive Advantages:
Experienced Staff
Green Product
Prompt Delivery
Quality Approvals
Small Orders Accepted



Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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