Introduction:
High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
Material:
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
FAQ:
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
A:YES
Product Details:
Payment & Shipping Terms:
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Color: | Green | Material: | Rogers Material |
---|---|---|---|
Layer: | 2 L | Board Size: | 19*38 CM |
Copper Thinknes: | 1 Oz | Min Line Width: | 4 Mil |
Min Line Space: | 4 Mil | Surface Finish: | Golden Finger |
Name: | Rogers Pcb | ||
High Light: | Quick Turn Pcb Fabrication,lead free pcb |
Double Sided Microwave Antennas Circuits With ER 3.5 For Remote Control Satellite Radios
Quick Detail :
Material | Rogers |
Type | Pcb |
Layer | 2 |
Thinkness Board | 0.508 mm |
Surface Finish | Golden Finger |
Color | Green |
Size | 19*38cm |
ER | 3.5 |
Features:
Microwave/RF PCB & High Frequency PCB uses materials of excellent dielectric property for its main body with other dielectric materials and metal substrates matched to complete corresponding multi-layer processing or thick-film processing and manufacture and to achieve the transmission functions of excellent high thermal conductivity, low dielectric constant, high frequency and high speed. HF rogers material with low loss lo DF low DK can widely used in wirelsss antenna of satellite radios .Otherwise the microwave range matches many military feilds . It can control the radios and other telecomunications in satelite area .
RF PCB are widely used in microwave transmission, Automobile telephone, wireless networks, wireless communications and satellite microwave communications, in particular the popularity of 3G networks exacerbate the market demand for the product on the RF PCB. The feauter of the circuit board surface finish with golden finger have high conductive characotors. This model rogers 4350 B with double sided half hole buried through vias . And the materials copper thinckness is 1 oz .Its board thinckness including 0.127 mm 0.254 mm 0.508 mm 0.8 mm 1.6 and so on .
Description :
Low dielectric high-frequency multilayer rogers pcb ,improve the rogers pcb 's conductivity and the high quality make the customer save more costs .
High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.
High Frequency PCB Introuduction | |||
Model | Parameter | thickness(mm) | Permittivity(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
RO4003 | 0.508 | 3.38 | |
TACONIC | TLF-35 | 0.8 | 3.5 |
TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
RF-60A | 0.64 | 6.15 | |
TLY-5 | 0.254,0.508,0.8 | 2.2 | |
TLC-32 | 0.8,1.5,3 | 3.2 | |
TLA-35 | 0.8 | 3.2 | |
ARLON | AD255C06099C | 1.5 | 2.55 |
MCG0300CG | 0.8 | 3.7 | |
AD0300C | 0.8 | 3 | |
AD255C03099C | 0.8 | 2.55 | |
AD255C04099C | 1 | 2.55 | |
DLC220 | 1 | 2.2 |
Production Description :
XCE PCB technical specifications | ||
Annual stock Material | Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free | |
Layer No. | 1~16 | |
Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
|
Max panel size | 508*610mm | |
Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% | |
Wall hole copper thickness | >0.025mm(1mil) | |
Finished hole | 0.2mm-6.3mm | |
Min line width | 4mil/4mil(0.1/0.1mm) | |
Min bonding pad space | 0.1mm(4mil) | |
PTH aperture tolerance | ±0.075mm(3mil) | |
NPTH aperture tolerance | ±0.05mm(2mil) | |
Hole site deviation | ±0.05mm(2mil) | |
Profile tolerance | ±0.10mm(4mil) | |
Board bend&warp | ≤0.7% | |
Insulation resistance | >1012Ωnormal | |
Through-hole resistance | <300Ωnormal | |
Electric strength | >1.3kv/mm | |
Current breakdown | 10A | |
Peel strength | 1.4N/mm | |
Soldmask regidity | >6H | |
Thermal stress | 288℃20Sec | |
Testing voltage | 50-300V | |
Min buried blind via | 0.2mm(8mil) | |
Outer copper thickness | 1oz-5oz | |
Inner cooper thickness | 1/2 oz-4oz | |
Aspect ratio | 8:1 | |
SMT min green oil width | 0.08mm | |
Min green oil open window | 0.05mm | |
Insulation layer thickless | 0.075mm-5mm | |
Taphole aperture | 0.2mm-0.6mm | |
Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB | |
Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.