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High Frequency PCB

Introduction:

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

Material:

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

High Frequency Rogers Pcb With Microwave Widely Used In Antenna and RF System

Large Image : High Frequency Rogers Pcb With Microwave Widely Used In Antenna and RF System

Product Details:

Place of Origin:	China
Brand Name:	XCE
Certification:	CE,ROHS,FCC,ISO9008,SGS,UL
Model Number:	XCE BI5

Payment & Shipping Terms:

Minimum Order Quantity:	MOQ 1 Piece
Price:	Negotiation
Packaging Details:	1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time:	5-10 working days
Payment Terms:	T/T, Western Union
Supply Ability:	1000000 pieces per week

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Detailed Product Description

Color:	Gray	Material:	Rogers Material
Layer:	Multilayer	Board Size:	6*6cm
Copper Thinknes:	1 Oz	Min Line Width:	4 Mil
Min Line Space:	4mil	Surface Finish:	Immersion Silver
Name:	Rogers Pcb
High Light:	custom pcb printing , printed circuit board pcb

High Frequency Rogers Pcb With Microwave Widely Used In Antenna and RF System

Quick Detail :

Type	High Frequency Pcb
Color	Gray
Size	6*6cm
Material	Rogers
Permittivity	2
Surface Finish	Immersion Silver

Features:

Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .Immersion gold surface finish make the pcb 's conductive performance enhancements. Multilayer pcb design ,the precision of the pcb improves much more better . Low dielectric : 3 dielectric conductivity much more precision . High Frequency founction used in RF microwave feilds .

Parameter:

Model	Parameter	thickness(mm)	Permittivity(ER)
Rogers	RO5880	0.254 0.508 0.762	2.20 ± 0.02
	RO4350	0.254 0.508,0.8,1.524	3.5
	RO6010	0.635 1.27	10.2
	RO3003	0.127 0.254 0.508 0.762 1.524	3
	RO3010	0.254 0.508 0.635 0.762	10.2
	RO3035	0.508	3.5
	RO4003	0.508	3.38

Description :

RT/duroid® Laminates

RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications. It aslo used in RF Mcrowave wireless Antenna , microwave radio . It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

High Thermal Performance

Tg of 200 (DSC), 230°C (DMA)
Low CTE for reliability
Lead-free Compatible & Rhos Complaint
UV Blocking and AOI Fluorescence
Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat

Key Benefits:

High dielectric constant for circuit size reduction
Low loss. Ideal for operating at X-band or below
Tight εr and thickness control for repeatable circuit performance

Typical Applications:

Space Saving Circuitry
Patch Antennas
Satellite Communications Systems
Power Amplifiers
Aircraft Collision Avoidance Systems
Ground Radar Warning Systems
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure

Production Description :

Parameter	Value
Speciﬁc gravity/density	1.850 g/cm³ (3,118 lb/cu yd)
Water absorption	−0.125 in < 0.10%
Temperature index	140 °C (284 °F)
Thermal conductivity, through-plane	0.29 W/(m·K),^[1] 0.343 W/(m·K)^[2]
Thermal conductivity, in-plane	0.81 W/(m·K),^[1] 1.059 W/(m·K)^[2]
Rockwell hardness	110 M scale
Bond strength	> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW	> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW	> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW	> 310 MPa (45,000 psi)
Izod impact strength - LW	> 54 J/m (10 ft·lb/in)
Izod impact strength - CW	> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise	> 415 MPa (60,200 psi)
Dielectric breakdown (A)	> 50 kV
Dielectric breakdown (D48/50)	> 50 kV
Dielectric strength	20 MV/m
Relative permittivity (A)	4.8
Relative permittivity (D24/23)	4.8
Dissipation factor (A)	0.017
Dissipation factor (D24/23)	0.018
Dielectric constant permittivity	4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature	Can vary, but is over 120 °C
Young's modulus - LW	3.5×10⁶ psi (24 GPa)
Young's modulus - CW	3.0×10⁶ psi (21 GPa)
Coefficient of thermal expansion - x-axis	1.4×10⁻⁵ K⁻¹
Coefficient of thermal expansion - y-axis	1.2×10⁻⁵ K⁻¹
Coefficient of thermal expansion - z-axis	7.0×10⁻⁵ K⁻¹
Poisson's ratio - LW	0.136
Poisson's ratio - CW	0.118
LW sound speed	3602 m/s
SW sound speed	3369 m/s

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Tag:

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946