High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet
PTFE + woven glass
Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50
Loss tangent (DF): 0.0030@10GHz
Copper adhesion: 12ibs / inch
Water absorption: ≤0.02%
Surface resistance: 1X1016 Ω
Volume resistivity: lXl012Ω
Thermal conductivity: 0.8 kcal / m / h ℃
Working temperature: -50 ~ + 260 ℃
Payment & Shipping Terms:
|Copper Thinknes:||1 Oz||Min Line Width:||4 Mil|
|Min Line Space:||4mil||Surface Finish:||Immersion Silver|
custom pcb printing,
printed circuit board pcb
High Frequency Monolithic Microwave Integrated Circuit Amplifier With 1Oz Copper 4 Mil
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multialyer
4. Products Size :10*6cm
5. Permittivity :3
6. Surface finish : Immersion Silver
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 3 dielectric conductivity much more precision .
|Rogers||RO5880||0.254 0.508 0.762||2.20 ± 0.02|
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.
RO3000 series laminates are circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems. The dielectric constant versus temperature of RO3000 series materials is very stable.
High Thermal Performance
Tg of 200 (DSC), 230°C (DMA)
Low CTE for reliability
Lead-free Compatible & Rhos Complaint
UV Blocking and AOI Fluorescence
Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.
Production Description :
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.