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Taconic PCB

Introduction:

We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials

Sufficient stock:

We have sufficient rogers material raw as follow:

TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Taconic PCB Sample Introduction

Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin

Large Image : Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin

Product Details:

Place of Origin:	China
Brand Name:	XCE
Certification:	CE,ROHS,FCC,ISO9008,SGS,UL
Model Number:	XCE BG61

Payment & Shipping Terms:

Minimum Order Quantity:	MOQ 1 Piece
Price:	Negotiation
Packaging Details:	1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time:	5-10 working days
Payment Terms:	T/T, Western Union
Supply Ability:	1000000 pieces per week

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Detailed Product Description

Color:	Yellow	Material:	Rogers Material
Layer:	Multilayer	Board Size:	10*8cm
Copper Thinknes:	1 Oz	Min Line Width:	4 Mil
Min Line Space:	4mil	Surface Finish:	Immersion Tin
Name:	Rogers Pcb
High Light:	Pcb Board Prototype , Printing Circuit Boards

High Quality Rogers Ro 3010 Pcb With Immersion Tin Apply for Audio Amplifier Board

Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :10*8cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin

Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision .

Parameter:

Model	Parameter	thickness(mm)	Permittivity(ER)
F4B	F4B	0.38	2.2
	F4B	0.55	2.23
	F4B	0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0	2.65
	F4Bk	0.8,1.5	2.65
	F4B	0.8	3.5
	FE=F4BM	1	2.2
Rogers	RO5880	0.254 0.508 0.762	2.20 ± 0.02
	RO4350	0.254 0.508,0.8,1.524	3.5
	RO4003	0.508	3.38
TACONIC	TLF-35	0.8	3.5
	TLA-6	0.254,0.8,1,1.5,	2.65
	TLX-8	0.254,0.8,1,1.6	2.55
	RF-60A	0.64	6.15
	TLY-5	0.254,0.508,0.8	2.2
	TLC-32	0.8,1.5,3	3.2
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2

Description :

RO3000® Laminates

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.

RO3000 series laminates are circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems. The dielectric constant versus temperature of RO3000 series materials is very stable.

High Thermal Performance

Tg of 200 (DSC), 230°C (DMA)
Low CTE for reliability
Lead-free Compatible & Rhos Complaint
UV Blocking and AOI Fluorescence
Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat

PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Key Benefits:

High dielectric constant for circuit size reduction
Low loss. Ideal for operating at X-band or below
Tight εr and thickness control for repeatable circuit performance

Typical Applications:

Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems - power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
RFID Tags
Surface mount RF components
E-Band point to point microwave links

Production Description :

Parameter	Value
Speciﬁc gravity/density	1.850 g/cm³ (3,118 lb/cu yd)
Water absorption	−0.125 in < 0.10%
Temperature index	140 °C (284 °F)
Thermal conductivity, through-plane	0.29 W/(m·K),^[1] 0.343 W/(m·K)^[2]
Thermal conductivity, in-plane	0.81 W/(m·K),^[1] 1.059 W/(m·K)^[2]
Rockwell hardness	110 M scale
Bond strength	> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW	> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW	> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW	> 310 MPa (45,000 psi)
Izod impact strength - LW	> 54 J/m (10 ft·lb/in)
Izod impact strength - CW	> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise	> 415 MPa (60,200 psi)
Dielectric breakdown (A)	> 50 kV
Dielectric breakdown (D48/50)	> 50 kV
Dielectric strength	20 MV/m
Relative permittivity (A)	4.8
Relative permittivity (D24/23)	4.8
Dissipation factor (A)	0.017
Dissipation factor (D24/23)	0.018
Dielectric constant permittivity	4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature	Can vary, but is over 120 °C
Young's modulus - LW	3.5×10⁶ psi (24 GPa)
Young's modulus - CW	3.0×10⁶ psi (21 GPa)
Coefficient of thermal expansion - x-axis	1.4×10⁻⁵ K⁻¹
Coefficient of thermal expansion - y-axis	1.2×10⁻⁵ K⁻¹
Coefficient of thermal expansion - z-axis	7.0×10⁻⁵ K⁻¹
Poisson's ratio - LW	0.136
Poisson's ratio - CW	0.118
LW sound speed	3602 m/s
SW sound speed	3369 m/s

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Tag:

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946