HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.
HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.
Payment & Shipping Terms:
|Copper Thinknes:||1 Oz||Min Line Width:||5 Mil|
|Min Line Space:||5 Mil||Surface Finish:||Immersion Gold|
single sided pcb board,
pcb circuit board
Half Hole DHI Fr4 Single Sided Pcb Immersion Silver Surface Rogers Pcb Multilayer Circuit Board
Quick Detail :
1. Type : Pcb
2. Material : Fr4+rogers
3. Layer : Single Sided
4. Products Size : 8*6 cm
5. Permittivity : 10.2
6. Surface finish : Immersion Gold
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 10.2 dielectric conductivity much more precision .
Low dielectric high-frequency multilayer rogers pcb ,improve the fr4 custom pcb 's conductivity and the high quality make the customer save more costs .
High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.
Production Description :
|XCE PCB technical specifications|
|Annual stock Material||Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free|
|Min board thickness||
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
|Max panel size||508*610mm|
|Board thickness tolerance||T≥0.8mm±8%.,T<0.8mm±5%|
|Wall hole copper thickness||>0.025mm(1mil)|
|Min line width||4mil/4mil(0.1/0.1mm)|
|Min bonding pad space||0.1mm(4mil)|
|PTH aperture tolerance||±0.075mm(3mil)|
|NPTH aperture tolerance||±0.05mm(2mil)|
|Hole site deviation||±0.05mm(2mil)|
|Min buried blind via||0.2mm(8mil)|
|Outer copper thickness||1oz-5oz|
|Inner cooper thickness||1/2 oz-4oz|
|SMT min green oil width||0.08mm|
|Min green oil open window||0.05mm|
|Insulation layer thickless||0.075mm-5mm|
|Special technology||Indepedance,Blind buried via,thick gold,aluminum PCB|
|Surface finish||HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating|
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.