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Introduction:
Xinchenger provides hobbyist and engineers from around the world with high-quality Quick Turn PCBs at affordable prices. Depending on your PCB requirements, we have a fast turnaround time of just 24 hours. You must submit your files before 9am for same day quick turnaround services. Please call us directly for more information on this service.
Engineers can depend on Xinchenger because of our reliable on time delivery percentage and high quality manufacturing. Get a faster turnaround time than our standard lead time of 2 weeks, which allows for your company to prototype your critical PCBs faster. With our affordable prices and reliability, decrease the probability for poor quality PCBs and increase your ROI for your PCB prototyping with Xinchenger
Quickturn Printed Circuit Board Fabrication Highlights:
Accelerated PCB production times
1 (same day to 24 hours), 2, or 3 day turnaround times
Speed up entry into market
Full and Prototype Boards available
Fast and accurate human reviewed PCB quotes
We provide high quality PCB manufacturing with full in house capabilities for projects small and large.
Product Details:
Payment & Shipping Terms:
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| Base Material: | ShengYi FR4 | Name: | Multilayer Pcb |
|---|---|---|---|
| Board Thickness: | 1.2mm | Copper THK: | 1OZ |
| Board Size: | 10*9cm | Surface Finish: | HASL |
| High Light: | circuit board fabrication,printed circuit board fabrication |
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4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication
Quick detail:
| Surface: Lead free HASL | Layer number:4 |
| Special technology:blind hole | Hole:PTH |
| Origin:China | Model:XCEF |
Specification
PCB Type: | multilayer PCB |
Layer : | 4 layer |
Min .Line Width/Space: | 3mil/3mil |
Min. Via Diameter: | 0.3mm |
Finish Thickness: | 0.2mm |
Surface Finish: | ENIG |
Size: | 10*9MM |
Material: | fr4 |
Color: | blue |
Application: | telecommunication |
Parameter
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
High frequency PCB Introduce:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Description:
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.
Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.
