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Introduction:
Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section
Types:
2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.
Product Details:
Payment & Shipping Terms:
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| Min Line Space: | 0.2mm | Min Line Width: | 0.2mm |
|---|---|---|---|
| Copper Thickness: | 2OZ | Size: | 8*6cm |
| Board THK: | 1.2MM | Panel: | 1 |
| Surface Finish: | ENIG+Gold Plated | Color: | Green |
| Material: | FR4 High TG | Model: | XCEM |
| High Light: | multi layered pcb,multilayer pcb fabrication |
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2+6+2 Stack Up Impedance HDI Multilayer PCB FR4 With Rogers Mixed Compression
Specification:
Type: 2+6+2 Stack up Impedance HDI
Material:
Layer Count: 10
Finish Thickness: 1.2+8%mm
Min. Via dia: 0.2mm
Surface Finish: ENIG+Hard Gold Plating
Specialty:
L1-2, L2-3, L8-9, L9-10: Resin fill, laser blind via of 0.1mm; L3-8: Buried via and resin filled.
Parameter:
| PCB parameter | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
