 |
|
|
|
|
Introduction:
High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet
Material:
PTFE + woven glass
Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50
Loss tangent (DF): 0.0030@10GHz
Copper adhesion: 12ibs / inch
Water absorption: ≤0.02%
Surface resistance: 1X1016 Ω
Volume resistivity: lXl012Ω
Thermal conductivity: 0.8 kcal / m / h ℃
Working temperature: -50 ~ + 260 ℃
Product Details:
Payment & Shipping Terms:
|
| Surface Finish: | HASL Lead Free | Board THK: | 0.6mm |
|---|---|---|---|
| Product Name: | High Frequency Pcb | Size: | 5*5 |
| High Light: | custom pcb printing,printed circuit board pcb |
||
FR4 High Frequency PCB Mixed Compression Roger 4350B Blind Hole Material
Specification:
Board size: 5*5 cm
Layer: 6
Model: XCEH
Board thickness: 0.6mm
Copper foil: 35UM
Material: FR4&Rogers
Parameter:
| Layer No. | 1-16 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance T≥0.8mm±8%,T＜0.8mm±5% | |||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
