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Introduction:
High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet
Material:
PTFE + woven glass
Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50
Loss tangent (DF): 0.0030@10GHz
Copper adhesion: 12ibs / inch
Water absorption: ≤0.02%
Surface resistance: 1X1016 Ω
Volume resistivity: lXl012Ω
Thermal conductivity: 0.8 kcal / m / h ℃
Working temperature: -50 ~ + 260 ℃
Product Details:
Payment & Shipping Terms:
|
| Product Name: | High Frequency Pcb | Layer Of Number: | 2 |
|---|---|---|---|
| Surface Finish: | Gold Plating | Base Material: | Rogers 4003C |
| Cu THK: | 1OZ | Board THK: | 0.2mm |
| High Light: | custom pcb printing,printed circuit board pcb |
||
Rogers 4003C High Frequency PCB With Gold Plating Surface Finish
Specification:
|
Materia raw |
Rogers RO4003c |
Board THK |
0.2mm |
|
Layer |
2 |
Solder mask |
white |
|
Surface finish |
gold plated |
Line space |
0.1mm |
|
Copper THK |
1OZ |
Line width |
0.1mm |
Quick detail:
Model:XCEH
Board size:5*6cm
Origin: China
Brand:XCE
Parameter
|
XCE PCB technical specifications |
|
|
Material |
F4B |
|
Layer No. |
6 |
|
Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
|
Max panel size |
508*610mm |
|
Board thickness tolerance |
T≥0.8mm±8%.,T<0.8mm±5% |
|
Wall hole copper thickness |
>0.025mm(1mil) |
|
Finished hole |
0.2mm-6.3mm |
|
Min line width |
4mil/4mil(0.1/0.1mm) |
|
Min bonding pad space |
0.1mm(4mil) |
|
PTH aperture tolerance |
±0.075mm(3mil) |
|
NPTH aperture tolerance |
±0.05mm(2mil) |
|
Hole site deviation |
±0.05mm(2mil) |
|
Profile tolerance |
±0.10mm(4mil) |
|
Board bend&warp |
≤0.7% |
|
Insulation resistance |
>1012Ωnormal |
|
Through-hole resistance |
<300Ωnormal |
|
Electric strength |
>1.3kv/mm |
|
Current breakdown |
10A |
|
Peel strength |
1.4N/mm |
|
Soldmask regidity |
>6H |
|
Thermal stress |
288℃20Sec |
|
Testing voltage |
50-300V |
|
Min buried blind via |
0.2mm(8mil) |
|
Outer copper thickness |
1oz-5oz |
|
Inner cooper thickness |
1/2 oz-4oz |
|
Aspect ratio |
8:1 |
|
SMT min green oil width |
0.08mm |
|
Min green oil open window |
0.05mm |
|
Insulation layer thickless |
0.075mm-5mm |
|
Taphole aperture |
0.2mm-0.6mm |
|
Special technology |
Indepedance,Blind buried via,thick gold,aluminum PCB |
|
Surface finish |
HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
Application:
Mobile communication products, amplifier, low noise amplifier,GSM, CDMA,
3G smart antenna,splitters, diplexers, filters, couplers and other passive components
Advantage:
OEM/ODM services are welcome
Heavy copper PCB, Heavy gold PCB, Blind & Buried PCB Board, FPC Flex-Rigid,HDI PCB, Impedance
control panel High layer count PCB, are available.
Factory direct wholesale price
Replying with price within 1 hour
Shipping within 24 hours
Certificate: ROHS, UL,SGS,9001-2000, ISO14001, SGS Lead-Free
