 |
|
|
|
|
Introduction:
High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet
Material:
PTFE + woven glass
Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50
Loss tangent (DF): 0.0030@10GHz
Copper adhesion: 12ibs / inch
Water absorption: ≤0.02%
Surface resistance: 1X1016 Ω
Volume resistivity: lXl012Ω
Thermal conductivity: 0.8 kcal / m / h ℃
Working temperature: -50 ~ + 260 ℃
Product Details:
Payment & Shipping Terms:
|
| Material: | Rogers | Layer: | 2 |
|---|---|---|---|
| Color: | / | Min Line Space: | 4mil |
| Min Line Width: | 4mil | Copper Thickness: | 1OZ |
| Board Size: | 58*159mm | Panel: | 1 |
| Surface: | Immersion Gold | ||
| High Light: | custom pcb printing,printed circuit board pcb |
||
High Temperature Tape High Frequency PCB Wireless Rogers 4003 PCB With Bluetooth Moudle
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
Layer: 2 Layer
Material: PTFE
Board Thickness: 1.6mm
Surface Treatment: Immersion Gold
Solder Mask: Green
Size:58*159mm
Copper Thickness: 1.0oZ
Min. Line Spacing: 0.25mm
Min Trace Space: 0.25mm
Detailed Terms for Pcb Assembly
We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Rogers PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing.
1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.
4. ROHS compliant and lead-free process.
5. In-circuit, functional tests& burn-in tests, full system test
6. High output to guarantee prompt delivery.
We have experience in manufacturing PCB from single layer till 18layers, Nowdays, more and more high fluquency boards are demanded, we have a special department for those field PCBs.
And we have some professional engineers for taking care of those PCBs too. We can provide much lower price than the marcket because of large material ordered by one time. Welcome you join to us.
XCE have the ability of manufacturing many types of specail board. The products are including Rogers, and Teflon Board.
Standard dimension: 490 X 490mm 600 X 500mm (optional dimension for discussion)
Standard thickness: 1.0, 1.5, 2.0, 3.0 mm(optional dimension for discussion)
Copper foil thickness: 35um, 70um, 105um, 140um, 210um
Heat conduction and insulating layer thickness: 60um
Specification:
| Brand: XCE |
| Model: XCEH |
| Board size: 58*159MM |
| Cu thickness: 35UM |
| Material: Rogers |
| Min line space&width: 5Mil |
Advantage
High Temperature Tape PCB Board Wireless Rogers 4003 PCB With Bluetooth Moudle
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
Parameter:
| PRODUCT’S DETAILS | |
| Raw Material | Rogers |
| Layer Count | 2-Layer |
| Board Thickness | 1.6mm |
| Copper Thickness | 35UM |
| Surface Finish | Immerison Silver |
| Solder Mask | / |
| Silkscreen | / |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 60*159mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
We can offer production with high quality and competitive:
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L_18L, HDI | 20-28 , HDI |
| Material | FR4 | |
| Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , Rogers3003+FR4 | ||
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink, | ||
| 1-2L Lead-time | 3-7 days | 1-2 days |
| 4- 8L Lead-time | 7-10 days | 2-7 days |
| 10-18L Lead-time | 10-15 days | 4-9 days |
| 20-28L Lead-time | 15-20 days | |
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
Parameter
| XCE PCB technical specifications | |
| Material | Rogers |
| Layer No. | 2 |
| Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
| Max panel size | 508*610mm |
| Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% |
| Wall hole copper thickness | >0.025mm(1mil) |
| Finished hole | 0.2mm-6.3mm |
| Min line width | 4mil/4mil(0.1/0.1mm) |
| Min bonding pad space | 0.1mm(4mil) |
| PTH aperture tolerance | ±0.075mm(3mil) |
| NPTH aperture tolerance | ±0.05mm(2mil) |
| Hole site deviation | ±0.05mm(2mil) |
| Profile tolerance | ±0.10mm(4mil) |
| Board bend&warp | ≤0.7% |
| Insulation resistance | >1012Ωnormal |
| Through-hole resistance | <300Ωnormal |
| Electric strength | >1.3kv/mm |
| Current breakdown | 10A |
| Peel strength | 1.4N/mm |
| Soldmask regidity | >6H |
| Thermal stress | 288℃20Sec |
| Testing voltage | 50-300V |
| Min buried blind via | 0.2mm(8mil) |
| Outer copper thickness | 1oz-5oz |
| Inner cooper thickness | 1/2 oz-4oz |
| Aspect ratio | 8:1 |
| SMT min green oil width | 0.08mm |
| Min green oil open window | 0.05mm |
| Insulation layer thickless | 0.075mm-5mm |
| Taphole aperture | 0.2mm-0.6mm |
| Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB |
| Surface finish |
HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
