Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

Sales & Support
Request A Quote - Email
Select Language
English
Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesFR4 PCB

Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

I'm Online Chat Now

FR4 PCB

  • High Precision FR4 PCB suppliers

Introduction:

High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board

High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.

Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.

 

Material:

(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate

(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss

(3) Consistent with the thermal expansion coefficient of copper

(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

 

 

FAQ:

Q:How to get a PCB prototype quotation?

A:1.PCB Gerber file

2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)

Q:Is your tooling cost one-off payment?

A:YES

 

 

 

FR4 PCB Sample Introduction

Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask

China Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask Supplier
Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask Supplier Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask Supplier

Large Image :  Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008
Model Number: XCEI-1

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Contact Now
Detailed Product Description
Product Name: Isola PCB Layer Of Number: 6 Layers
Surface Finish: Immersion Gold,ENIG Base Material: Isola
Size: 16*10cm Board THK: 1.2mm
High Light:

electronic pcb board

,

Quick Turn Pcb Fabrication

Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask

 

Specification:

 

 

  1. Surface finish:Immersion gold,ENIG
  2. 6 layer 1.2mm thickness
  3. Green solder mask,white silk screen
  4. Line space and width:10mil
  5. Certification:ISO9001/SGS/UL
  6. Delivery time:3-7 working days
  7. Quick detail:
  8. Model:XCEI-1
  9. Size: 16*10cm
  10. Copper THK:35UM
  11. Color: Green

 

Application:

 

Automotive,Backplanes,RF / Microwave,High End Computing

Signal Integrity,Medical,Military,Mobile Devices / Wireless Handsets

Railway,Servers,Switches/Routers,Thermal Management,Wireless Infrastructure 

 

Parameter

 

o.

Item

Spec

1

Layers

6 layers

2

Max working panel area

457 x 610 mm

3

Min board thickness

4 layer: 0.40mm

6 layer: 0.80mm

8 layer: 1.00mm

10 layer: 1.20mm

4

Min trace width

0.10mm

5

Min spacing

0.10mm

6

Min hole diameter

0.20mm

7

Min Copper thickness in hole

0.020mm

8

PTH size tolerance

±0.05mm

9

NPTH size tolerance

±0.025mm

10

Hole position tolerance

±0.05mm

11

Dimension tolerance

±0.1mm

12

Min solder mask dam

0.08mm

13

Insulation resistance

1E+12Ω (normal condition)

14

Max Board thickness/Hole size Rate

'10:01

15

Thermal shock endurance

288 3 times in 10sec

16

Max Board twist and wrap

≤0.7%

17

High Vlotage endurance

1.3KV/mm

18

Copper foil peel off endurance

1.4N/mm

19

Hardness of resist ink

≥6H

20

Flame resistance

94V-0

21

Impedance control

±5%

 

Advantage:

 

Have stock of Scarcity of material,short time of incoming material,save costing for you

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)