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Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.
Sufficient stock:
We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Layer: | 2 Layer | Color: | Green |
|---|---|---|---|
| Material: | FR4 | Surface: | HASL Lead Free |
| High Light: | pcb manufacturing process,Custom Printed Circuit Board |
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Turnkey Solar Inverter FR4 PCB Circuit Board With Design Service
Specification:
| Layers:2 | Material:FR4 |
| Board thickness:1.2MM | Copper thickness:1.5OZ |
| Min hole size:8mil | Min line space:8mil |
| Min line width:8mil | Surface:Lead free |
| Solder mask color: green | Certificate:Iso9001,SGS |
Parameter:
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Copper thickness in hole |
>25.0 um (>1mil) |
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Size |
Max. Board Size: 23 × 25 (580mm×900mm) |
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Min. Drilled Hole Size: 3mil (0.075mm) |
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Min. Line Width: 3mil (0.075mm) |
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Min. Line Spacing: 3mil (0.075mm) |
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Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
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Tolerance
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Shape tolerance: ±0.13 |
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Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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Certificate |
UL, ISO 9001, ISO 14001 |
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Special requirements |
Buried and blind vias+controlled impedance +BGA |
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Profiling |
Punching, Routing, V-CUT, Beveling |
| Any other special material please feel free to let us know | |
Description:
Standard products(4, 6 layers), FR4, photo-sensitive soldermask
Special types (thick copper, thin core, hard gold, etc)
High layer count(8-40 layers)
High Density Interconnection (HDI): micro-via technology, build-up construction, laser holes, very small tracks, etc…
Low cost CPTH: polymer conductive holes with copper paste. 4 layers, FR4
Back panels: thick PCBs, press-fit technology, large size PCBs.
