RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal.
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon and other dedicated microwave substrates.
RF board standards:
1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2,In the RF PCB, every component should compact configuration to ensure that the shortest connection
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be
separated from the RF part.
4, To choose the components working in high frequency environment should use of surface-mount component as far as possible. Because the surface-mount component is small volume generally and the pin of component is very short.
Payment & Shipping Terms:
|Color:||Black||Min Line Space:||5mil|
|Min Line Width:||5mil||Copper Thickness:||1OZ|
pcb printed circuit board,
Making Printed Circuit Boards
Taconic Teflon PCB Board Design Laminate Copper Foil PCB
|Origin:China||Special: High frequency pcb|
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
Taconic Advanced Dielectric branch provides PTFE / woven glass fiber cloth sheet of microwave, radio frequency (RF) and high-speed digital signal processing market. This material can be applied to LNAs, LNBs, PCS / PCN antenna system, global positioning system (GPS) and UMTS antenna system, and a power amplifier, passive components, collision avoidance radar systems, aviation technology and remote assistant director phased array radar system.
The factory focused on high-frequency microwave RF PCB processing, RF circuit boards, microstrip circuit boards, antenna circuit boards, thermal circuit boards, amplifiers, 3G antennas, splitters, couplers, high frequency board, ARLON high-frequency board, TACOINC high frequency board, ROGERS high frequency board, F4BM high frequency board, Rogers high frequency board, Taikang Nike high frequency board, microwave PCB board, microwave RF PCB board, antenna board
|1||Layer:||1 to 24 layers|
|2||Material type:||FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers|
|3||Board thickness:||0.20mm to 3.4mm|
|4||Copper thickness:||0.5 OZ to 4 OZ|
|5||Copper thickness in hole:||>25.0 um (>1mil)|
|6||Max. Board Size:||(580mm×1200mm)|
|7||Min. Drilled Hole Size:||4mil(0.1mm)|
|8||Min. Line Width:||3mil (0.075mm)|
|9||Min. Line Spacing:||3mil (0.075mm)|
|10||Surface finishing:||HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|11||Solder Mask Color:||Green/Yellow/Black/White/Red/Blue|
|13||Hole tolerance:||PTH: ±0.076 NPTH: ±0.05|
|14||Package:||Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing|
|16||Special requirements:||Buried and blind vias+controlled impedance +BGA|
|17||Profiling:||Punching, Routing, V-CUT, Beveling|
Taconic's Industrial Products Division produces PTFE and silicone coated fabrics, tapes and belts for a wide range of industrial applications. These durable coatings offer a host of benefits that make them ideal for demanding environments.
Our expertise can help solve application challenges in food processing, packaging, aerospace, automotive, PVC welding, lamination, screen printing, textile drying/curing, composite molding and plastics and chemical processin
Taconic's Advanced Dielectric Division is a world leader in RF laminates, prepregs and high speed digital and flexible interconnect materials utilized in some of the most cutting-edge communication systems in the world.
Our thermally conductive low loss materials are designed for use in antennas, power amplifiers, filters, passive components, automotive cruise control, semiconductor chip testing/packaging, aerospace guidance telemetry, high density interconnect and phase array radar.