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Introduction:
Rigid flex PCB have been used in the military and aerospace industries for more than 20 years. In most rigid flex circuit boards, the circuitry consists of multiple flexible circuit inner layers selectively attached together using an epoxy pre-preg bonding film, similar to a multilayer flexible circuit. However, a multilayer rigid flex circuit incorporates a board externally, internally or both as needed to accomplish the design.
Rigid flex PCB combine the best of both rigid boards and flexible circuits integrated together into one circuit. The two-in-one circuit is interconnected through plated thru holes. Rigid flex circuits provide higher component density and better quality control. Designs are rigid where extra support is needed and flexible around corners and areas requiring extra space.
Flex and Rigid-Flex applications also provide increased reliability. Mean time between failure rates (MTBF) typically exceed those of standard PCB sets with discrete wires and connectors, often becoming the choice of companies and engineers alike for its dependable and consistent performance.
Types:
Flexible Printed Circuit Boards with 8 layers rigid PCB
Single-Sided Flexible with rigid PCB board up to 6 layer
Double-Sided Flexible Printed Circuit Boards with 4 layer to 12 layer rigid pcb
Multilayer Flexible Printed Circuit Boards with multilayer rigid PCB
Product Details:
Payment & Shipping Terms:
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| Layer: | 1 | Brand: | XCE |
|---|---|---|---|
| Model: | XCEC | Size: | 70*90mm |
| Panel: | 8*2 | Color: | Gray |
| High Light: | custom-made pcb,custom pcb |
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Taconic OSP Custom PCB Boards Single Sided Circuit Fabrication
Quick detail:
Base material: Taconic
Board thickness: 0.6mm
Customized: YES
Copper thickness: 70UM
Min line space and width: 0.2MM
Technology:
our products have passed UL, ISO9001 and IS014001 certifications.
NO | ITEM | Technical capabilities |
1 | Layers | 1-30 layers |
2 | Max. Board size | 2000×610mm |
3 | Min. board Thickness | 2-layer 0.15mm |
4-layer 0.38mm | ||
6-layer 0.55mm | ||
8-layer 0.80mm | ||
10-layer 1.0mm | ||
4 | Min. line Width/Space | 0.075mm(3mil) |
5 | Max. Copper thickness | 6OZ |
6 | Min. S/M Pitch | 0.075mm(3mil) |
7 | Min. hole size | 0.1mm(4mil) |
8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
10 | Hole position deviation | ±0.05mm(2mil) |
11 | Outline tolerance | ±0.10mm(4mil) |
12 | Twist & Bent | 0.75% |
13 | Insulation Resistance | >1012Ω Normal |
14 | Electric strength | >1.3kv/mm |
15 | S/M abrasion | >6H |
16 | Thermal stress | 288°C 20Sec |
17 | Test Voltage | 50-300V |
18 | Min. blind/buried via | 0.15mm (6mil) |
19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
Company:
Company spirit:Customer first,openness basing on sincerity.
Comapny culture:Improve employees quality with on the job training.
Quality policy:Honesty,superior quality,high efficiency.
Company tenet: Provide customers with satisfactory products and service is our eternal tenet.
