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System Printed Board High Frequency Rogers PCB Board Audio Amplifier Application

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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Taconic PCB

  • High Precision Taconic PCB suppliers

Introduction:

We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials

 

Sufficient stock:

We have sufficient rogers material raw as follow:

TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Taconic PCB Sample Introduction

System Printed Board High Frequency Rogers PCB Board Audio Amplifier Application

China System Printed Board High Frequency Rogers PCB Board Audio Amplifier Application Supplier

Large Image :  System Printed Board High Frequency Rogers PCB Board Audio Amplifier Application

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: Rogers Layer: 4
Color: Green Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 88*66mm Panel: 1
Surface: ENIG
High Light:

Pcb Design And Fabrication

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Printing Circuit Boards

System Printed Board High Frequency Rogers PCB Board Audio Amplifier Application In 0.79mm

 

 

Quick detail:

Origin:China Special: High frequency pcb
Layer:4 Thickness:0.79mm
Surface: ENIG Hole:0.2

 


Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .Immersion gold surface finish make the pcb 's conductive performance enhancements. Multilayer pcb design ,the precision of the pcb improves much more better . Low dielectric : 3 dielectric conductivity much more precision .

 

 

System Printed Board High Frequency Rogers PCB Board
Quick detail:
Material: Rogers 4350B 0.254MM 0.508MM
PP material Rogers 4450
Core: 3 or 4
Stack up files: Necessary
Gerber files:Necessary 

 

System Printed Board High Frequency Rogers PCB Board The basic characteristics of a high frequency board material requirements are the following:
(1) dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate and the dielectric constant of the material
Inversely proportional to the square root of high dielectric constant is likely to cause the signal propagation delay.
(2) the dielectric loss (Df) must be small, mainly affect the quality, the smaller the dielectric loss signal transmission of the signal loss is smaller.
(3) as far as possible consistent with the coefficient of thermal expansion of the copper foil, copper foil separated because of inconsistency will cause changes in the hot and cold.
(4) to low water absorption, high water absorption will affect the dielectric constant and dielectric loss when damp.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

 

 

Typical Applications:

  • Space Saving Circuitry
  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes
  • LMDS and wireless broadband
  • Base station infrastructure

 

System Printed Board High Frequency Rogers PCB Board Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

 

We have sufficient rogers material raw as follow:RO4003C,RO4350B,RO4360,RO4533,RO4535,RO4730,RO4232,RO4233,RO3003,RO3006,RO3010,RO3035,RO3203,RO3206,RO3210,RO3730,RO5780,RO5880,RO6002,RO3202,RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

 

 

Parameter:

 

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 

 

Features

 

 

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

 

PrePreg Material

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl

 

 

Rogers material in stock:

 

Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

 


Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

Company Service:
24 hours quick sample is avaliable here.
reply Customer's any enquiry within 3 hours;
Blind buried hole ,crossed blind hole can be done
24 hours Engineering Gerber files treatment.
24 hours English Engineering Questions Confirmation by E-mail.
Supply the best project fit for production customized
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)