Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Home SamplesHDI PCB

Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

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Good quality Multilayer PCB
Good quality Multilayer PCB
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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

China Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board Supplier
Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board Supplier Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board Supplier

Large Image :  Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS
Model Number: XCES

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Board THK: 1.0mm Surface Finish: ENIG
Origin: China Cu Thickness: 3OZ
Min Line Space And Width: 5mil Color: Green
High Light:

single side pcb

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single sided pcb board

Metal Clad Single Sided PCBs Backed PTFE / Micorowave Circuits Maker

 

 

Description:

 

Model: XCES
Layer: 2
Size: 5*9 cm
Special: Metal clad heavy copper
Material: FR4

 

 

Technical Details:

 

    Material: copper basis
    layer count: 1-26L
    Board thickness: 0.2-3.2mm
    Finishing copper thickness: 0.5-4oz
    Solder mask:green
    Silkscreen:white
    Surface Finish: OSP
    Flying probe testing: 100%pass
    Minimum hole size: 0.2mm
    Minimum track width/space: 0.25/0.25mm
    Certificates: UL,SGS,ISO9001:2008

 

Advantage:

  • Blind and/or buried vias
  • Via-in-pad
  • Through vias from surface to surface
  • 20 um circuit geometries
  • 30 um dielectric layers
  • 50 um laser vias
  • 125 um bump pitch processing

FR4 (Tg – 135C, 145C, 170C)
    Rogers Ultralam 2000
    Rogers RO4350
    Rogers RO4003
    Polyimide
    Teflon
    Black FR4
    Getek Copper
    Clad Thermal Substrates
    Hybrid (Rogers and FR4)
    BT Epoxy
    Nelco 4013

 

HASL – Leaded Solder Tin/Nickel  
    HASL – Lead Free Solder
    Electroless Soft Gold
    Wire Bondable Soft Gold
    Nickel Flash Gold
    Electroless Nickel 
    Immersion Gold OSP 
    Electrolytic Nickel /Hard Gold and Selective Gold
    Immersion Silver
    Immersion Tin
    Carbon Ink
    ENIG

 

 Layer: 1 to 36 layers
    Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    Board thickness: 0.21mm to 3.4mm
    Copper thickness: 0.5 OZ to 4 OZ
    Copper thickness in hole: >25.0 um (>1mil)
Size:
    - Max. Board Size: (580mm×1200mm)
    - Min. Drilled Hole Size: 4mil(0.1mm)
    - Min. Line Width: 3mil (0.075mm)
    - Min. Line Spacing: 3mil (0.075mm)


   Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold,          OSP, Gold plating
   Solder Mask Color: Green/Yellow/Black/White/Red/Blue

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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