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Introduction:
We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials
Sufficient stock:
We have sufficient rogers material raw as follow:
TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Surface Finish: | ENIG | Board THK: | 0.508mm |
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| Product Name: | High Frequency Pcb | Size: | 2*2cm |
| High Light: | Pcb Board Prototype,Printing Circuit Boards |
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RT5880 Rogers PCB 0.254 / 0.508 / 0.762MM DK2.2 4 Layer Board
Specification:
Description:
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.
Parameter:
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PRODUCT’S DETAILS |
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Raw Material |
Rogers |
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Layer Count |
4-Layer |
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Board Thickness |
0.508mm |
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Copper Thickness |
35UM |
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Surface Finish |
ENIG |
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Solder Mask |
green |
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Silkscreen |
White |
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Min. Trace Width/Spacing |
0.075/0.075mm |
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Min. Hole Size |
0.25mm |
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Hole Wall Copper Thickness |
≥20μm |
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Measurement |
300×400mm |
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Packaging |
Inner: Vacuum-packed in soft plastic bales |
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Application |
Communication,automobile,cell,computer,medical |
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Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
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Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
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Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
