Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

China ROHS PCB Circuit Board Fabrication With Immersion Gold Surface Supplier
ROHS PCB Circuit Board Fabrication With Immersion Gold Surface Supplier ROHS PCB Circuit Board Fabrication With Immersion Gold Surface Supplier

Large Image :  ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCES

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: Fr4 Layer: 2
Color: Green Min Line Space: 5mil
Min Line Width: 5mil Copper Thickness: 2OZ
Board Size: 2*2cm Panel: 20*1
Surface: ENIG
High Light:

pcb circuit board

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single sided pcb board

Single Sided PCB Circuit Board Fabrication With Immersion Gold Surface

 

 

 

Quick detail:

Origin:China Line space:5mil
Layer:2 Thickness:0.2mm
Surface: ENIG Hole:0.8

 

 

Parameter:

XCE PCB technical specifications
Annual stock Material Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No. 1~16 multilayer pcb
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size 508*610mm
Board thickness tolerance T0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp 0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 28820Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 

Files:Gerber,protel,powerpcb,Autocad,etc.

Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,Aluminum

Layer count:1-24 layers multilayer pcb

Max.Panel Size:450*1500mm

Board Thickness:0.2-5mm

Min. Core Thickness:0.075mm

Cu Thickness:12-140um

Min. Drill Size:0.2mm

Max. Aspect Ratio: 8:1

Min. Trace Width: 0.1mm

Min line spacing:0.075mm

Min. SMT/QFP Pitch:0.4mm

 

 

 

 

v Fast PCB Fabrication for Samples and Mass Production

v Electronic Components Sourcing Services

v PCBA Assembly Services:SMT,DIP,BGA...

v Function Test

v Stencil,Cable and Enclosure Assembly

v Reverse engineering service

v Standard Packing and On time Delivery

 

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • RF Identification (RFID) Tags
  • LNB’s for Direct Broadcast Satellites

 

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.

 

 

Features

 

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

 

ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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