Rigid flex PCB have been used in the military and aerospace industries for more than 20 years. In most rigid flex circuit boards, the circuitry consists of multiple flexible circuit inner layers selectively attached together using an epoxy pre-preg bonding film, similar to a multilayer flexible circuit. However, a multilayer rigid flex circuit incorporates a board externally, internally or both as needed to accomplish the design.
Rigid flex PCB combine the best of both rigid boards and flexible circuits integrated together into one circuit. The two-in-one circuit is interconnected through plated thru holes. Rigid flex circuits provide higher component density and better quality control. Designs are rigid where extra support is needed and flexible around corners and areas requiring extra space.
Flex and Rigid-Flex applications also provide increased reliability. Mean time between failure rates (MTBF) typically exceed those of standard PCB sets with discrete wires and connectors, often becoming the choice of companies and engineers alike for its dependable and consistent performance.
Flexible Printed Circuit Boards with 8 layers rigid PCB
Single-Sided Flexible with rigid PCB board up to 6 layer
Double-Sided Flexible Printed Circuit Boards with 4 layer to 12 layer rigid pcb
Multilayer Flexible Printed Circuit Boards with multilayer rigid PCB
Payment & Shipping Terms:
|Copper Thinknes:||1 Oz||Min Line Width:||4 Mil|
|Min Line Space:||4mil||Surface Finish:||Immersion Tin|
RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask
Quick Detail :
1. Type : Pcb
2. Material : FR4
3. Layer : Multilayer
4. Products Size: 7*6cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,Cooper Base,high frequency material,Rogers,Taconic,Isola,F4B,Arlon
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
4.RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
|Layer||1 to 28 layers|
|Board thickness||0.21mm to 7.0mm|
|Copper thickness||0.5 OZ to 7.0 OZ|
|Copper thickness in hole||>25.0 um (>1mil)|
|Max. Board Size: 23 × 25 (580mm×900mm)|
|Min. Drilled Hole Size: 3mil (0.075mm)|
|Min. Line Width: 3mil (0.075mm)|
|Min. Line Spacing: 3mil (0.075mm)|
|HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|Shape tolerance: ±0.13|
|Hole tolerance: PTH: ±0.076 NPTH: ±0.05|
|Certificate||UL, ISO 9001, ISO 14001|
|Special requirements||Buried and blind vias+controlled impedance +BGA|
|Profiling||Punching, Routing, V-CUT, Beveling|
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
Production Description :
|Total Pad Size||Standard||Advanced|
|Capture Pad||Drill + 0.008||Drill + 0.006|
|Landing Pad||Drill + 0.008||Drill + 0.006|
|BC Mechanical Drill (Type III)||0.008||0.006|
|Laser Drill Size||0.004-0.010||0.0025|
|Type I Capabilities single & Double Deep||Yes||Yes|
|Type II Capabilities Buried Vias with Microvias||Yes||Yes|
|Type III Capabilities||Yes||Yes|
|Copper Filled Microvia||Yes||Yes|
|Smallest Copper Filled Microvia||0.004||0.0025|
|Copper Filled Microvia Aspect Ratio||0.75:1||1:01|
|Smallest Laser Microvia Hole Size||0.004||0.0025|
|Laser Via Aspect Ratio (Depth:Diameter)||0.75:1||c|
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.