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Introduction:
We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials
Sufficient stock:
We have sufficient rogers material raw as follow:
TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Base Material: | Rogers 4003 | Product Name: | Electronic Pcb/2K*4K Android Quad Core Motherboard/PCB Prototype/Electronic Circuit Board |
|---|---|---|---|
| Number Of Layers: | 8-Layer | Copper Thickness: | Inner 1/2 Oz-4oz;Outer 1oz-5oz |
| Board Thickness: | Mechanical Drill: 8mil(0.2mm) | Surface Finishing: | HASL/HASL Lead Free/immersion Gold/ENIG |
| Min. Line Width: | 0.075mm(3mil) | Min. Line Spacing: | 0.1mm(4mil) |
| Min. Hole Size: | 0.1mm(4mil) | Rogers High Frequency PCB: | China Rogers Printed Circuit Board |
| Service: | One Stop Turnkey Service | SMT Efficiency: | BGA.QFP.SOP.QFN.PLCC.CHIP |
| Testing Service: | X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing | Application: | Industrial Control/Medical Device Consumer/Communications/Electronics Device/Unicycle/Computer Pcb |
| High Light: | Pcb Board Prototype,Pcb Design And Fabrication |
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Rogers Multilayer PCB High Tech 0.254mm 1OZ For Radar Systems
| Model: | XCEH | Origin: | Shenzhen |
|---|---|---|---|
| Size: | 9*12cm | Panel: | 3*2 |
| Brand: | XCE | Color: | Green |
Specification
Multilayer Pcb High Tech Mixed Compression Rf RO3006 0.254mm For Radar Systems
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.
Get a Production PCBs Quote
Submit your PCB design
| PCB production capability | |
| Files | Gerber, Protel, Powerpcb, Autocad, Orcad, Eagle,etc. |
| Material |
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM- 1, 94V0,Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
| Layer No. | 1 - 28 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.5OZ - 4OZ |
| Impedance Control | ±10% |
| Warpage | 0.075%-1.5% |
| Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
| Min Trace Width (a) | 0.005"(0.125mm) |
| Min Space Width (b) | 0.005"(0.125mm) |
| Min Annular Ring | 0.005"(0.125mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Regesiter torlerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Soldermask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Aspect Ratio | 6:01 |
| Hole Registration | 0.004"(0.1mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish |
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001:2008 TS16949 SGS UL CE |
| Special requirements |
Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Testing Service:X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing
Which widely be used for :
Automotive Antennas / RFID
Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability
Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital
High frequency:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Advantage
1. PCB factory directly
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
One stop PCB assembly services Samples in 2-3 days | Bulk orders in 1 week | 2-year warranties Complete OEM assembly performed in-house Handle all customer's needs for PCB assembly,
component purchasing, and other product assemblies
We quote for clients within 3 working days
Testing: PCBA in-circuit testing, PCBA function testing, AOI, X-ray inspection Experience range:
industrial, automotive, computing and storage And consumer, instrumentation, medical, networking, peripherals, telecommunications
Our product range covers various fields, i.e. consumer electronics, telecommunications, industrial products, auto mobile assemblies, medical equipments etc.
Our main services include electronics and metal, casing manufacturing, such as PCB fabrication, component purchasing, PCB assembly, plastic injection molding, high volume metal stamping, die-casting and custom fabrication.
Up to now, Xingchenger has over 500 employees based in China, with well-trained staffs and professional working attitudes, we believe our effective solutions can satisfy our customers’ needs through manufacturing expertise and a culture of continuous improvement. culture of continuous improvement.
