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Rogers 3006 Stack Up FR4 4 Multi Layered Pcb Multilayer Pcb Manufacturing

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

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Multilayer PCB

  • High Precision Multilayer PCB suppliers

Introduction:


Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section

 

Types:


2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.

Multilayer PCB Sample Introduction

Rogers 3006 Stack Up FR4 4 Multi Layered Pcb Multilayer Pcb Manufacturing

China Rogers 3006 Stack Up FR4 4 Multi Layered Pcb Multilayer Pcb Manufacturing Supplier
Rogers 3006 Stack Up FR4 4 Multi Layered Pcb Multilayer Pcb Manufacturing Supplier Rogers 3006 Stack Up FR4 4 Multi Layered Pcb Multilayer Pcb Manufacturing Supplier

Large Image :  Rogers 3006 Stack Up FR4 4 Multi Layered Pcb Multilayer Pcb Manufacturing

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: Rogers+fr4 Layer: 4
Color: Green Min Line Space: 5mil
Min Line Width: 5mil Copper Thickness: 2OZ
Board Size: 8*6cm Panel: 1
Surface: ENIG
High Light:

multi layered pcb

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multilayer pcb manufacturing

Rogers 3006 Stack Up FR4 4 Layer Multilayer PCB Printed Circuit Board Fabrication

 

 

 

Quick detail:

Origin:China Special: 2 raw material mix compression
Layer:4 Thickness:1.2mm
Surface: ENIG Hole:0.8

 

 

Specification:

RO4350B™ materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.

Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.

RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.

 

 

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • RF Identification (RFID) Tags
  • LNB’s for Direct Broadcast Satellites

 

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.

 

 

Parameter:

 

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 

 

Features

 

 

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

 

 

Rogers material in stock:

 

Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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