High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet
PTFE + woven glass
Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50
Loss tangent (DF): 0.0030@10GHz
Copper adhesion: 12ibs / inch
Water absorption: ≤0.02%
Surface resistance: 1X1016 Ω
Volume resistivity: lXl012Ω
Thermal conductivity: 0.8 kcal / m / h ℃
Working temperature: -50 ~ + 260 ℃
Payment & Shipping Terms:
|Board Material:||Rogers 4003C||Board Thickness:||0.254MM|
|Surface Finish:||Immersion Gold||Copper Weight:||35um|
custom pcb printing,
printed circuit board pcb
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you multilayer microwave rogers rf pcb with competitive price. Just be free to buy good multilayer microwave rogers rf pcb at reasonable price with us and get the datasheet from our suppliers who can working for you.
RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal.
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon
and other dedicated microwave substrates.
RF board standards:
1, In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2, In the RF PCB, every component should compact configuration to ensure that the shortest connection
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be
separated from the RF part.
4, To choose the components working in high frequency environment
should use of surface-mount component as far as possible.
Because the surface-mount component is small volume generally and the pin of component
is very short.
Important Note: Below is a wide range of applications, demands, and budgets.
The table below provides general recommendations:
|RF Application||RF Materials||Bonding Materials||Attributes|
RO3000 Series Bondply
|Cost effective with dependable electrical and thermal characteristics|
|RO4450B / RO4450F||The best in electrical and thermal performance and environmental durability|
|High Power Applications||
|Superior thermal management|
RO4400 Bondply / 2929
|Versatile high performance properties to suit a range of device types|
|RO4400 Bondply||Excellent electrical performance compatible with standard manufacturing processes|
|Excellent durability and environmental resistances, including oxidation|