RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal.
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon and other dedicated microwave substrates.
RF board standards:
1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2,In the RF PCB, every component should compact configuration to ensure that the shortest connection
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be
separated from the RF part.
4, To choose the components working in high frequency environment should use of surface-mount component as far as possible. Because the surface-mount component is small volume generally and the pin of component is very short.
Payment & Shipping Terms:
|Color:||Black||Min Line Space:||5mil|
|Min Line Width:||5mil||Copper Thickness:||1OZ|
quick turn PCB,
Making Printed Circuit Boards
OEM Printed Circuit Board PCB TLY Military Low DK Base 0.254mm
|Origin:China||Special: High frequency pcb|
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
Taconic Advanced Dielectric branch provides PTFE / woven glass fiber cloth sheet of microwave, radio frequency (RF) and high-speed digital signal processing market. This material can be applied to LNAs, LNBs, PCS / PCN antenna system, global positioning system (GPS) and UMTS antenna system, and a power amplifier, passive components, collision avoidance radar systems, aviation technology and remote assistant director phased array radar system.
|1||Layer:||1 to 24 layers|
|2||Material type:||FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers|
|3||Board thickness:||0.20mm to 3.4mm|
|4||Copper thickness:||0.5 OZ to 4 OZ|
|5||Copper thickness in hole:||>25.0 um (>1mil)|
|6||Max. Board Size:||(580mm×1200mm)|
|7||Min. Drilled Hole Size:||4mil(0.1mm)|
|8||Min. Line Width:||3mil (0.075mm)|
|9||Min. Line Spacing:||3mil (0.075mm)|
|10||Surface finishing:||HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|11||Solder Mask Color:||Green/Yellow/Black/White/Red/Blue|
|13||Hole tolerance:||PTH: ±0.076 NPTH: ±0.05|
|14||Package:||Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing|
|16||Special requirements:||Buried and blind vias+controlled impedance +BGA|
|17||Profiling:||Punching, Routing, V-CUT, Beveling|
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock: