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Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.
Sufficient stock:
We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Panel: | 2*1 | Color: | Black |
|---|---|---|---|
| Layer: | 6 | Brand: | XCE |
| Model: | XCEC | Size: | 10*8cm |
| High Light: | fr4 circuit board,Custom Printed Circuit Board |
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OEM / ODM Service Rigid Custom PCB Boards For Automatic Car System
Quick detail:
| Layer: 6 |
| Board thickness: 1.0mm |
| Copper THK: 0.5oz |
| Min line space and width: 2mil |
| BGA: YES |
| Base material: Teflon |
High frequency telecom.high speed transmission high security.
High transmission quality.high memory transaction
Specification
Teflon PCB
Single.double Sided Teflon PCB
NPTH,PTH
Conductor width control: ±0.02mm
Hole wall copper ≥ 20μм
Thermal stress 288°C.10sec.
Permitivity ε2.1-10.0
Profile:punching or routing.tolerance ±0.10.0-0.13mm
Final product thickness 0.5,0.8,1.0,1.2,1.6mm
Base copper thickness Normal 0.5 1.0 OZ
Solder Mask Taiyo PSR4000.Tamura DSR2200
Solder mask thickness on tracks 20-30 μм
Parameter:
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
