Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Home SamplesHigh Frequency PCB

Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

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Good quality Multilayer PCB
Good quality Multilayer PCB
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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

China Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects Supplier
Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects Supplier Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects Supplier Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects Supplier

Large Image :  Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE/ROHS/SGS/MSDS/UL
Model Number: XCE

Payment & Shipping Terms:

Minimum Order Quantity: 1pc
Price: negotiation
Packaging Details: anti-static pacni
Supply Ability: 1000000pcs/month
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Detailed Product Description
Material: Rogers Series Layer: 2-48layers
Smallest Pad Size: .001″ /size (.001″ / 0.025mm Annular Ring) 0.025mm Annular Ring Smallest Finished Via: .004″ / 0.102mm
Inner Layer Pads: 025″ / 0.635mm Oversize Minimum
High Light:

custom pcb printing

,

printed circuit board design

XCE specialize in manufacturing various hi-frequency PCB and multilayer board including fastest sample products. Provides you with a unique one stop solution to all your printed circuit needs, including PCB manufacturing and assembly.

 

 

Radar microwave circuit board (PCB) production,Doppler sensor module LED light board,5.8G,24G sensor board, speed electronic dog motherboard,Rogeros high frequency board,Taconic high frequency board, TP-2 special media board,Board,F4B domestic high-frequency board,Rogeros and FR4 mixing plate,4G antenna high frequency board,4G base station high frequency board.

 

Highlights:

Rigid PCB–2 Layer to 48 Layers

Blind/buried via

Backplane

High Density Interconnects (HDI)

Board thickness 8mm

Maximum copper thickness 8 oz

 

PCB surface finish:

HASL

Leadfree HASL

OSP

ENIG Immersion Gold

Immersion tin

Flash gold

 

Laminate Materials:

FR4 Normal and high-TG

Rogers

Taconic

Isola

F4B

 

Special requirements:

Peelable solder mask

Carbon ink

Buried capacitor/resistor

 

Quality Standard certifications:

ISO9001

QS9000

ISO14001

TS16949

AS9100

UL Underwriter Laboratories

 

IPC-600 Class 2 Standard manufacturing specifications
IPC-600 Class 3 Available as required
IPC-6012 Available as required with in-house testing capabilities

 

 

 

Inner layer pads 025″ / 0.635mm oversize minimum
Smallest finished via .004″ / 0.102mm
Standard pad size (.002″/ 0.051mm annular ring) 0085″ / 0.216mm annular ring (.017″ / 0.432mm oversize)
Smallest pad size (.001″ / 0.025mm annular ring) .0075″ / 0.191mm annular ring (.015″ / 0.038mm oversize)
Standard line and spacing .005″ / .005″ (0.127mm / 0.127mm)
Special line and spacing .003″ / .003″ (0.076mm / 0.076mm)

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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