Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Quick Detail :
1. Type : Pcb
2. Material : Fr4
3. Layer : Multilayer
4. Products Size :12*6cm
5. Permittivity : 3
6. Surface finish : Gold Plating
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 3 dielectric conductivity much more precision .
Description :
Most printed circuit boards are manufactured using glass-reinforced epoxy laminate as the substrate. While there are a wide variety of laminates available on the market, FR-4 is both versatile and well-accepted as a standard material for PCB manufacture. FR-4 functions well as an electrical insulator, and has a good strength-to-weight ratio, and is flame resistant.
The standard FR-4 material that is used in our PCBExpress® Quickturn, ValueProto® and the default material for our PCBpro® Full Feature products is a high temperature, high Td, low CTE 150Tg material.
If a higher Tg material is required, we do stock a 170Tg version of our standard FR-4 material as well, that can be substituted in our PCBpro Full Feature and Custom Quote products (provide a readme file or a print note specifying the 170 Tg material). There may be a material lead time for some specific sizes or thickness, and may impact due date.
Key Benefits:
- High dielectric constant for circuit size reduction
- Low loss. Ideal for operating at X-band or below
- Tight εr and thickness control for repeatable circuit performance
Typical Applications:
- Space Saving Circuitry
- Patch Antennas
- Satellite Communications Systems
- Power Amplifiers
- Aircraft Collision Avoidance Systems
- Ground Radar Warning Systems
Production Description :
| Parameter |
Value |
| Specific gravity/density |
1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption |
−0.125 in < 0.10% |
| Temperature index |
140 °C (284 °F) |
| Thermal conductivity, through-plane |
0.29 W/(m·K),[1] 0.343 W/(m·K)[2] |
| Thermal conductivity, in-plane |
0.81 W/(m·K),[1] 1.059 W/(m·K)[2] |
| Rockwell hardness |
110 M scale |
| Bond strength |
> 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW |
> 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW |
> 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW |
> 310 MPa (45,000 psi) |
| Izod impact strength - LW |
> 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW |
> 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise |
> 415 MPa (60,200 psi) |
| Dielectric breakdown (A) |
> 50 kV |
| Dielectric breakdown (D48/50) |
> 50 kV |
| Dielectric strength |
20 MV/m |
| Relative permittivity (A) |
4.8 |
| Relative permittivity (D24/23) |
4.8 |
| Dissipation factor (A) |
0.017 |
| Dissipation factor (D24/23) |
0.018 |
| Dielectric constant permittivity |
4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature |
Can vary, but is over 120 °C |
| Young's modulus - LW |
3.5×106 psi (24 GPa) |
| Young's modulus - CW |
3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis |
1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis |
1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis |
7.0×10−5 K−1 |
| Poisson's ratio - LW |
0.136 |
| Poisson's ratio - CW |
0.118 |
| LW sound speed |
3602 m/s |
| SW sound speed |
3369 m/s |
|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
