Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

Sales & Support
Request A Quote - Email
Select Language
English
Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesRigid Flex PCB

Multilayer Custom PCB Boards Through Hole Blind Buried Vias 10 Layer PCB Circuit Board

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

I'm Online Chat Now

Rigid Flex PCB

  • High Precision Rigid Flex PCB suppliers

Introduction:
Rigid flex PCB have been used in the military and aerospace industries for more than 20 years. In most rigid flex circuit boards, the circuitry consists of multiple flexible circuit inner layers selectively attached together using an epoxy pre-preg bonding film, similar to a multilayer flexible circuit. However, a multilayer rigid flex circuit incorporates a board externally, internally or both as needed to accomplish the design.


Rigid flex PCB combine the best of both rigid boards and flexible circuits integrated together into one circuit. The two-in-one circuit is interconnected through plated thru holes. Rigid flex circuits provide higher component density and better quality control. Designs are rigid where extra support is needed and flexible around corners and areas requiring extra space.


Flex and Rigid-Flex applications also provide increased reliability. Mean time between failure rates (MTBF) typically exceed those of standard PCB sets with discrete wires and connectors, often becoming the choice of companies and engineers alike for its dependable and consistent performance.

 

 

Types:
Flexible Printed Circuit Boards with 8 layers rigid PCB
Single-Sided Flexible with rigid PCB board up to 6 layer
Double-Sided Flexible Printed Circuit Boards with 4 layer to 12 layer rigid pcb
Multilayer Flexible Printed Circuit Boards with multilayer rigid PCB

Rigid Flex PCB Sample Introduction

Multilayer Custom PCB Boards Through Hole Blind Buried Vias 10 Layer PCB Circuit Board

China Multilayer Custom PCB Boards Through Hole Blind Buried Vias 10 Layer PCB Circuit Board Supplier
Multilayer Custom PCB Boards Through Hole Blind Buried Vias 10 Layer PCB Circuit Board Supplier Multilayer Custom PCB Boards Through Hole Blind Buried Vias 10 Layer PCB Circuit Board Supplier

Large Image :  Multilayer Custom PCB Boards Through Hole Blind Buried Vias 10 Layer PCB Circuit Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEC

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Contact Now
Detailed Product Description
Material: Fr4 Layer: 10
Color: Green Min Line Space: 5mil
Min Line Width: 5mil Copper Thickness: 2OZ
Board Size: 8*12cm Panel: 1
Surface: ENIG
High Light:

custom-made pcb

,

custom pcb

Multilayer Through Hole Blind Buried Vias 10 Layer PCB Circuit Board

 

 

 

Quick detail:

Origin:China Special: 10 layer
Layer:10 Thickness:2.0mm
Surface: ENIG Hole:0.8

 

 

Parameter:

XCE PCB technical specifications
Annual stock Material Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No. 1~16 multilayer pcb
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size 508*610mm
Board thickness tolerance T0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp 0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 28820Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 

Files:Gerber,protel,powerpcb,Autocad,etc.

Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,Aluminum

Layer count:1-24 layers multilayer pcb

Max.Panel Size:450*1500mm

Board Thickness:0.2-5mm

Min. Core Thickness:0.075mm

Cu Thickness:12-140um

Min. Drill Size:0.2mm

Max. Aspect Ratio: 8:1

Min. Trace Width: 0.1mm

Min line spacing:0.075mm

Min. SMT/QFP Pitch:0.4mm

 

 

 

 

v Fast PCB Fabrication for Samples and Mass Production

v Electronic Components Sourcing Services

v PCBA Assembly Services:SMT,DIP,BGA...

v Function Test

v Stencil,Cable and Enclosure Assembly

v Reverse engineering service

v Standard Packing and On time Delivery

 

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • RF Identification (RFID) Tags
  • LNB’s for Direct Broadcast Satellites

 

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.

 

 

Features

 

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

 

Multilayer Custom PCB Boards Through Hole Blind Buried Vias 10 Layer PCB Circuit Board

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)