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Multilayer 4003 Rogers PCB , Immersion Gold Printed PCB Board

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Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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Taconic PCB

  • High Precision Taconic PCB suppliers

Introduction:

We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials

 

Sufficient stock:

We have sufficient rogers material raw as follow:

TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Taconic PCB Sample Introduction

Multilayer 4003 Rogers PCB , Immersion Gold Printed PCB Board

China Multilayer 4003 Rogers PCB , Immersion Gold Printed PCB Board Supplier

Large Image :  Multilayer 4003 Rogers PCB , Immersion Gold Printed PCB Board

Product Details:

Place of Origin: China
Brand Name: Rogers
Certification: ISO9001/TS16949/IPC/ROHS/UL
Model Number: 4003

Payment & Shipping Terms:

Minimum Order Quantity: 5piece
Price: USD 0.1-10 Pieces
Packaging Details: inner:vacuum-packed bubble bag outer: carton box
Delivery Time: 5-8 work days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10000000Piece/Pieces per Month
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Detailed Product Description
Base Material: Rogers 4003 Product Name: Electronic Pcb/2K*4K Android Quad Core Motherboard/PCB Prototype/Electronic Circuit Board
Number Of Layers: 8-Layer Copper Thickness: Inner 1/2 Oz-4oz;Outer 1oz-5oz
Board Thickness: Mechanical Drill: 8mil(0.2mm) Surface Finishing: HASL/HASL Lead Free/immersion Gold/ENIG
Min. Line Width: 0.075mm(3mil) Min. Line Spacing: 0.1mm(4mil)
Min. Hole Size: 0.1mm(4mil) Rogers High Frequency PCB: China Rogers Printed Circuit Board
Service: One Stop Turnkey Service SMT Efficiency: BGA.QFP.SOP.QFN.PLCC.CHIP
Testing Service: X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing Application: Industrial Control/Medical Device Consumer/Communications/Electronics Device/Unicycle/Computer Pcb
High Light:

Pcb Board Prototype

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Pcb Design And Fabrication

 

Multilayer 4003 Rogers PCB , Immersion Gold Printed PCB Board

 

 

 

Specification:

Base material Rogers 4003C Board THK 1.6mm
Layer 2 Board size 8*6cm
Surface finish Immersion gold Line space 10mil
Copper THK 3OZ Line width 10 mil

 

Quick detail:

Rogers 4003 substrate

2 layer Rogers 4003 pcb material

Green solder mask,

white silk screen

Model:XCER-1

Size:8*6cm

Location:Shenzhen

 

Application:

a Telecom: transmitter. Receiver. Oscillator. Antenna.

b Satellite receiver

c Global location system, amplifier, satellite telecom

d Microwave transmission

e Automobile telephone

f Measure apparatus, LSI inspector, analyser, signal oscillator

g High frequency teletcom, high speed transmission, high security, high transmission quality, high memory transaction

 

Rogers pcb material in stock:

Brand Model Thickness(mm) DK(ER)
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

 

Multilayer rogers 4003C PCB DATA SHEET:

The methods employed to achieve low resistance electrical connections and good mechanical integrity fall into two categories: true fusion welding,

where the metals of the lead and the circuit pad are melted, and a form of diffusion where the joint is made without melting.

Welded Bonds: 1) Resistance Welding — The lead and circuit conductor are pressed together and a high current pulse (usually from a capacitor) passed between the two. Heat caused by the passage of the current through the resistance of the joint melts and welds the metal. 2) Parallel Gap Welding — This is a specialized form of resistance welding. In this case the electrical energy is supplied to a pair of parallel electrodes, which are in contact with the device leads. The weld depends upon conduction of heat generated in the lead to the circuit pad to melt and fuse them together 3) Percussive Arc Welding — The lead and pad are held a small distance apart and an arc is generated by applying a short pulse of RF energy to ionize the gap, followed by a discharge from the capacitor. As the arc decays, a mechanical device forces the two heated surfaces together and completes the weld. 4) Electron Beam Welding — A beam of high-speed electrons is focused in a vacuum on the lead and pad held together. The energy of the electrons is absorbed, raising the temperature to the melting point of the metals. 5) Laser Welding — Energy is focused on the work piece by an intense, collimated, monochromatic light beam that is absorbed and raises the temperature to the fusion point. 6) Soldering — The lead and pad are coated with a low melting point alloy and pressed together. Heat is applied either locally (by a heating tool) or generally (by infrared or oven heating) to melt the solder and weld the two components together.

Diffusion Bonding: 1) Ultrasonic Welding — Diffusion of metal between the lead and pad is induced by clamping the two together and applying mechanical energy in the form of ultrasonic sound vibration. The metal surfaces are cleaned by friction, which also heats them, aiding in the diffusion process, but temperatures do not reach the melting point. 2) Thermal Compression Bonding — Metal diffusion in this method is accomplished by heat and pressure applied to the cleaned surfaces of the lead and pad. The temperature is insuffi cient to give a true fusion weld. 3) Thermosonic Bonding — This method is a combination of ultrasonic and thermal compression bonding. The work is preheated, and ultrasonic energy is supplied through a gold capillary. Again, the weld is achieved at temperatures below the fusion point of the metal.

 

Place of Origin: China
Brand Name: XCE
Model Number: XCER-1
Port Shenzhen,HongKong

 

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: Inner:vacuum packed bubble bag Outer:carton box
Delivery Time: 5-10 days
Payment Terms: T/T,western union,paypal,L/C
Supply Ability: 1, 000, 000PCS/week

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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