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Introduction:
We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials
Sufficient stock:
We have sufficient rogers material raw as follow:
TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Board Thickness: | 0.2mm | Copper THK: | 1OZ |
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| Board Size: | 15*9cm | Surface Finish: | Immersion Gold |
| High Light: | Pcb Board Prototype,Pcb Design And Fabrication |
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Multi-layer HF Rogers PCB Sufficient Material In Automotive Device Application
Specification
Parameter
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
Advantage:
Newest PCB machine and top technology,professional engineer team
Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.
Accept utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.
Utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.
