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Microwave RF PCB Wireless Romote Control Printed Circuit Pcb

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Good quality Multilayer PCB
Good quality Multilayer PCB
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FR4 PCB

  • High Precision FR4 PCB suppliers

Introduction:

High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board

High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.

Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.

 

Material:

(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate

(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss

(3) Consistent with the thermal expansion coefficient of copper

(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

 

 

FAQ:

Q:How to get a PCB prototype quotation?

A:1.PCB Gerber file

2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)

Q:Is your tooling cost one-off payment?

A:YES

 

 

 

FR4 PCB Sample Introduction

Microwave RF PCB Wireless Romote Control Printed Circuit Pcb

China Microwave RF PCB Wireless Romote Control Printed Circuit Pcb Supplier
Microwave RF PCB Wireless Romote Control Printed Circuit Pcb Supplier Microwave RF PCB Wireless Romote Control Printed Circuit Pcb Supplier

Large Image :  Microwave RF PCB Wireless Romote Control Printed Circuit Pcb

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE BG6

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
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Detailed Product Description
Color: Green Material: FR4 Material
Layer: Multilayer Board Size: 8*8cm
Copper Thinknes: 1 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Silver
Name: FR4 Pcb
High Light:

electronic pcb board

,

lead free pcb

RF Microwave PCB Used For Wireless Romote Control Printed Circuit Pcb
Quick Detail :
1. Type : Pcb
2. Material : Fr4 
3. Layer : Multilayer 
4. Products Size :8*8cm
5. Permittivity : 2.5
6. Surface finish : Immersion Silver
 
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision .
 
 
Description :
FR4 is a mid Dk Df 3.65 0.0096, resin systerm . FR4 delivers 30% improvement in z-axis expansion and off 25% more electrical bandwidth (low loss) than competitive products in this space 
 
High Thermal Performance

  • Tg of 200 (DSC), 230°C (DMA)

  • Low CTE for reliability

  • Lead-free Compatible & Rhos Complaint

  • UV Blocking and AOI Fluorescence

  • Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat

 
 
PrePreg Material
 It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Key Benefits:

  • High dielectric constant for circuit size reduction
  • Low loss. Ideal for operating at X-band or below
  • Tight εr and thickness control for repeatable circuit performance

Typical Applications:

  • Space Saving Circuitry
  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s

 
 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
 

  
 
 
 
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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