High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
Payment & Shipping Terms:
|Board Size:||16*5cm||Board THK:||1.8mm|
|Cu THK:||35UM||Panel Size:||5*2|
electronic pcb board,
lead free pcb
Satellite Transceiver Microwave / RF PCB Printed Circuit Boards
|Minimum line width/spacing:||0.3mm|
|Minimum hole diameter:||0.2mm|
|Finishing copper thickness:||1oz|
|NPTH aperture tolerance||±0.05mm(2mil)|
|Hole site deviation||±0.05mm(2mil)|
|Min buried blind via||0.2mm(8mil)|
|Outer cooper thickness||1oz-5oz|
|Inner cooper thickness||1/2 oz-4oz|
|SMT min green oil width||0.08mm|
|Min green oil open window||0.05mm|
|Insulation layer thickness||0.075mm-5mm|
|Min board thickness||2 layer 0.2mm|
|4 layer 0.4mm|
|6 layer 0.6mm|
|8 layer 0.8mm|
|10 layer 1.0mm|
|Max panel size||508*610mm|
|Board thickness tolerance||T≥0.8mm±8%,T＜0.8mm±5%|
|Wall hole copper thickness||＞0.025mm(1mil)|
|Min line width||4mil/4mil(0.1/0.1mm)|
|Min bonding pad space||0.1mm(4mil)|
|PTH aperture tolerance||±0.075mm(3mil)|
Why choose us:
Product design: as per customer's drawing or sample
Production equipment: machining center, CNC engraving milling machine, CNC, lathe machine, milling machine, punching machine, CNC milling machines, centerless grinding, and many other precision equipment.
QC system: 100% inspection before shipment.
Packaging: vacuum bag, single polybag, bubble bags, wooden case or as requests.
Our company with good quality and sincere services.