RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal.
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon and other dedicated microwave substrates.
RF board standards:
1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2,In the RF PCB, every component should compact configuration to ensure that the shortest connection
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be
separated from the RF part.
4, To choose the components working in high frequency environment should use of surface-mount component as far as possible. Because the surface-mount component is small volume generally and the pin of component is very short.
Payment & Shipping Terms:
|Color:||White||Min Line Space:||5mil|
|Min Line Width:||5mil||Copper Thickness:||1OZ|
quick turn PCB,
Making Printed Circuit Boards
Low Loss Stable Dielectric Constant 2 layer pcb circuit board , 1 oz copper PCB 0.8mm Thickness
High Speed Design Frequency PCB Board TACONIC high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
Taconic materials are UL 94V-0 rated for active devices and high power RF designs.
High Speed Design Frequency PCB Board Special high electromagnetic frequency circuit boards, in general, can be defined as the frequency of the high frequency of 1GHz. Its physical properties, precision, technical parameters required is very high, commonly used in automotive anti-collision systems, satellite systems, radio systems, etc.
The basic characteristics of a high frequency board material requirements are the following:
(1) dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate and the dielectric constant of the material
Inversely proportional to the square root of high dielectric constant is likely to cause the signal propagation delay.
(2) the dielectric loss (Df) must be small, mainly affect the quality, the smaller the dielectric loss signal transmission of the signal loss is smaller.
(3) as far as possible consistent with the coefficient of thermal expansion of the copper foil, copper foil separated because of inconsistency will cause changes in the hot and cold.
(4) to low water absorption, high water absorption will affect the dielectric constant and dielectric loss when damp.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
The product features:
V Long antenna size (102 inch or 2591mm)
V Low loss (0.0009 @ 10GHz)
V Stable dielectric constant (+/- 0.02)
V copper skin surface flatness good 0.0015mm
V Strong adhesion (> 10 lb / in)
V Use smooth copper (calendered copper)
V reverse copper skin, improve and improve PIM
Very low water absorption
V NASA certification, most products can be used in the aerospace level.
Microwave Antenna 4 Layer PCB Board,Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
|1||Layer:||1 to 24 layers|
|2||Material type:||FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers|
|3||Board thickness:||0.20mm to 3.4mm|
|4||Copper thickness:||0.5 OZ to 4 OZ|
|5||Copper thickness in hole:||>25.0 um (>1mil)|
|6||Max. Board Size:||(580mm×1200mm)|
|7||Min. Drilled Hole Size:||4mil(0.1mm)|
|8||Min. Line Width:||3mil (0.075mm)|
|9||Min. Line Spacing:||3mil (0.075mm)|
|10||Surface finishing:||HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|11||Solder Mask Color:||Green/Yellow/Black/White/Red/Blue|
|13||Hole tolerance:||PTH: ±0.076 NPTH: ±0.05|
|14||Package:||Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing|
|16||Special requirements:||Buried and blind vias+controlled impedance +BGA|
|17||Profiling:||Punching, Routing, V-CUT, Beveling|