Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Isola FR408 High Frequency PCB With High TG Blind And Buried Vias Carbon Print

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
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High Frequency PCB

  • High Precision High Frequency PCB suppliers



High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet




PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

Isola FR408 High Frequency PCB With High TG Blind And Buried Vias Carbon Print

China Isola FR408 High Frequency PCB With High TG Blind And Buried Vias Carbon Print Supplier
Isola FR408 High Frequency PCB With High TG Blind And Buried Vias Carbon Print Supplier Isola FR408 High Frequency PCB With High TG Blind And Buried Vias Carbon Print Supplier Isola FR408 High Frequency PCB With High TG Blind And Buried Vias Carbon Print Supplier

Large Image :  Isola FR408 High Frequency PCB With High TG Blind And Buried Vias Carbon Print

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE Wb

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
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Detailed Product Description
Color: Green Material: Rogers Material
Layer: Multilayer Board Size: 18*18cm
Copper Thinknes: 1 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Silver
Name: Rogers Pcb
High Light:

custom pcb printing


printed circuit board pcb

High Frequency Isola FR408 Pcb With High TG Blind And Buried Vias Carbon Print

Products Details

Raw Material Rogers  
Layer Count Multilayer 
Board Thickness 0.5 mm
Copper Thickness 0.5 oz
Surface Finish Immersion Silver 
Solder Mask Green 
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 560*400mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable


PCB Capability


Layer 1-30L
Material CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb .
Board Thinckness 0.2-6mm
Max Finish Size 800*508mm
Min. Drill Hole Size 0.25mm
Min. Line Width 0.075mm(3mil)
Min. Line Spacing 0.075mm(3mil)
Surface finish HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
Copper thickness 0.5-4.0 Oz
Solder mask color green/black/white/red/blue/yellow
Inner packing Vacuum packing, Plastic Bag
Outer packing standard carton packing
Hole tolerance PTH:±0.076,NTPH:±0.05
Certificate ISO9001,SGS
Profiling punching Routing,V-CUT,Beveling






Isola FR408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.

Its low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques

This is the standard laminate used in our sector of the industry. We carry stocks of all the main variants. The standard thickness used is 1.6mm, but we also stock 0.8mm, 1.0mm, 1.2mm, 2.0mm, 2.4mm, and 3.2mm. The most common copper thickness is 35 microns or 1oz square foot but 70 microns 2 oz square Ft is regularly used for higher current applications.

Its closely related to FR5 which is the old high temperature version, but has now been replaced by the more common BT Epoxy type.

PrePreg Material

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl

 Compared Data : 

  Model ER Tanδ@ 1GHz Cter (ppm/℃)



FR4 Normal 4.6 0.030 17  
FR4 PCL370(FR4-HTG) 4.3 0.0015 51 17
FR4 117 (FR4-HTG) 4.4 0.013   17
Park Neclo N4000-6-FC BC (FR4-HTG) 4.1 0.0015   16

Competitive Advantage:
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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