Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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PCB Prototype Board

  • High Precision PCB Prototype Board suppliers
  • High Precision PCB Prototype Board suppliers

Layer

Fast delivery time

Normal delivery time

Single

24 hours

48 hours

Double

24 hours

96 hours

4 layer

48 hours

148 hours

6 layer

84 hours

168 hours

8 layer

120 hours

192 hours

10layer

144 hours

240 hours

12layer

156 hours

240 hours

14layer

156 hours

241 hours

16—20layer

According to your gerber file

 
 

PCB Prototype Board Sample Introduction

Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

China Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried Supplier
Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried Supplier Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried Supplier

Large Image :  Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEP

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Model: XCEP Origin: Shenzhen
Size: 9.5*10.5cm Brand: XCE
Color: Green
High Light:

prototype circuit board

,

pcb prototype service

Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried ​

 

 

 

Application:

 

Automobile

Backplanes

Servers and Networking

Telecommunications

Data Storage

Heavy Copper Application

 

 

Specification:

 

Base Material: fr4
Layer:2
Thickness: 1.0MM
Copper weight:2OZ
Surface finish: ENIG

 

 

High frequency:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254    0.508  0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2
 

 

 

Specification:
 

 Technology

Materials

  • Multilayer PCBs with 18 layers
  • Teflon

PCB thickness

Final copper

  • 2.6 mm 
  •  1OZ 

Conductor track widths

Minimum drilling diameter

  • ≥ 90 µm
  • 0.2 mm

Contour production

Solder masks

  • Milling
  • Scoring
  • Photosensitive solder mask systems
  • UV solder mask system, screen printing

Surfaces

Additional printing

 
         
 

  • Immersion gold
  • Identification printing, inkjet
  • Component printing, screen printing
  • Through-hole printing
  • Peelable solder mask (green mask)
  • Masking tape
  • Plugging

 

 
 
 
 
 
 
 
 
 

Layer

12-26

Material type

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

Board thickness

0.21mm to 7.0mm

Copper thickness

0.5 OZ to 6 oz

Size

Max. Board Size: 580mm×1100mm

Min. Drilled Hole Size: 0.2 mm (8 mil)

Min. Line Width: 4mil (0.1mm)

Min. Line Spacing: 4mil (0.1mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, 
Immersion Silver/Gold, OSP, Gold plating

Solder Mask Color

Green/Yellow/Black/White/Red/Blue

Tolerance

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001 

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling

 
 

 Why us ?

 

1)Professional engineer team --help you to check design and do engineering before production

2)Rich expierences in pcb production industry--provide high quality and competitive price pcb.

3) After-sales service--every problem you have will get our professional advice and solution.

4) Constant follow up-- make us have the fast reaction of your requirement.

5) Inspected by the Inspection Institution--ISO,UL,ROHS cerfiticated

 

 
 

Our PCB - Printed Circuit Board capabilities include:

  • One to Thirty Layers
  • Rigid Flex Circuit Board
  • One to Eight layer flexible PCB
  • Hybrid constructions PCB
  • Metal core (Aluminum)
  • PCB up to 6 oz inner layer
  • Finishes: HASL, HASL (Pb-free), Soft Bondable Gold, Electrolytic Gold, Immersion Gold, Immersion Silver, Immersion Tin, OSP.
  • Materials: Polyimide, Arlon, Nelco, Rogers, Getek, Polyclad
  • Impedance Control and Blink/Buried Vias, HDI, Microvias
  • RoHS Compliant (RoHS – Restrictions on the use Of Hazardous Substances)

 

 

 

 

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)