 |
|
|
|
|
Introduction:
Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section
Types:
2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.
Product Details:
Payment & Shipping Terms:
|
| Material: | FR4 | Layer: | 6 |
|---|---|---|---|
| Color: | Green | Min Line Space: | 4mil |
| Min Line Width: | 4mil | Copper Thickness: | 1OZ |
| Board Size: | 208*199mm | Panel: | 1 |
| Surface: | ENIG | ||
| High Light: | multi layered pcb,multilayer pcb fabrication |
||
Impedance Control 1oz copper pcb , UL RoHS Custom Printed Circuit Board
6 Layers PCB with Immersion Gold/Impedance Control/UL/RoHS Multilayer Board
Key Specifications/Special Features:
Main Export Markets:
Asia
Australasia
Central/South America
Eastern Europe
Mid East/Africa
North America
Western Europe
Specification:
8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.
Advantage Highlights
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Place of Origin: | Guangdong China (Mainland) | Brand Name: | XCE | Model Number: | XCEPCB008 |
Base Material: | FR4 | Copper Thickness: | 0.3-3oz | Board Thickness: | 0.3-6mm |
Min. Hole Size: | 0.2mm | Min. Line Width: | 3mil | Min. Line Spacing: | 3mil |
Surface Finishing: | HASL, OSP, Immersion Gold/Au, Immersion silver, etc. | Solder mask: | Green | PCB Standard: | IPC-A-610 E Class II-III |
Wrap and twist: | 5% | Layer Count: | 1-22 | profiling punching: | Routing, V-CUT, Beveling |
Max board size: | 1200mm*600mm | Hole tolerance: | PTH:±0.075,NTPH:±0.05 | PCB Tolerance of finished thickness: | ±5% |
PCB: | Customized | Product name: | pcb |
