Introduction:
Aluminum PCB/Metal Core PCB/MCPCB
Among all Metal core PCBs(MCPCBs,known for their ability to provide effective thermal dissipation for electronic products), Aluminum PCBs is the most common type-the base material consists of aluminum core with standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner, while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications.Aluminum PCBs printed by us are widely used for LED lighting, power equipment and automotive systems.
We can produce 1Layer, 2Layer ,4 Layer and 6l ayer Aluminum PCB.Multilayer aluminum PCB is mainly used by high power industria products,Like outdoor Led screen .
Aluminum Core materials:
Peeling strength (n/mm):1.8
Insulation resistance (ω):>1*10 g
Breakdown voltage (vdc):>2 k
Soakable soldering (°C/m):280°C/260°C,1 min,no bubble&delamination
Thermal conductivity (ω/m-k):>0.8
Thermal resistance (°C/ω):< 1.2
Combustibility:fv-o
Dielectric constant (1mhz):4
Dielectric loss angle (tangent):0.03
Product Details:
Payment & Shipping Terms:
|
Product Name: | High TG PCB | Layer Of Number: | 8 Layer |
---|---|---|---|
Surface Finish: | HASL Lead Free | Base Material: | FR4 |
Copper: | 2OZ | Board THK: | 1.2mm |
High Light: | pcb maker,printed circuit board manufacturing |
High Thermal Conductivity Kingboard FR4 8 Layer High TG PCB Circuit Board 1.2mm
Quick detail:
Specification:
Layer of number |
8 |
Surface finish |
HASL lead free |
Base material |
FR4 |
Copper |
2OZ |
Size |
11*3cm |
Hole diameter |
6mil |
Thickness |
1.2mm |
Forming |
V-cut |
Description:
Shenzhen Xinchenger Electronics makes PCB with unique composite materials to match the coefficient
of
thermal expansion for various heat generating devices.
180 ℃ high temperature resistance
High frequency PCB with heat sink for telecommunication and aerospace industries using customer
specific electrically and thermally conductive bonding films.
Application:
petrochemical industry,Mine industry
Parameter:
Layers |
1--28 |
Copper thickness |
1--6OZ |
Base material |
FR4(ITEQ,KB A+,HZ),HI-TG, FR06, |
Finished surface |
conventional hasl, lead free hasl, immersion gold, immersion tin, |
Soldermask |
green, black, yellow, white, blue, red...... |
Finished board thickness |
0.2-8.0mm |
Board thickness tolerance |
Board thickness≤1.0mm: +/-0.1mm |
Advantage:
24 hours quick sample production
Sufficient fr4 material raw