HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.
HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.
Payment & Shipping Terms:
|Copper Thinknes:||1 Oz||Min Line Width:||4 Mil|
|Min Line Space:||4mil||Surface Finish:||Immersion Tin|
single sided pcb board,
pcb circuit board
High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :11*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
|Rogers||RO5880||0.254 0.508 0.762||2.20 ± 0.02|
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
|Layer||1 to 28 layers|
|Material type||FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers|
|Board thickness||0.21mm to 7.0mm|
|Copper thickness||0.5 OZ to 7.0 OZ|
|Copper thickness in hole||>25.0 um (>1mil)|
|Max. Board Size: 23 × 25 (580mm×900mm)|
|Min. Drilled Hole Size: 3mil (0.075mm)|
|Min. Line Width: 3mil (0.075mm)|
|Min. Line Spacing: 3mil (0.075mm)|
|HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|Shape tolerance: ±0.13|
|Hole tolerance: PTH: ±0.076 NPTH: ±0.05|
|Certificate||UL, ISO 9001, ISO 14001|
|Special requirements||Buried and blind vias+controlled impedance +BGA|
|Profiling||Punching, Routing, V-CUT, Beveling|
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
• High Decomposition Temperature (Td) (> 325º C)
• Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)
• Dielectric Constant (@1 GHz): 4.25-4.55
• Dissipation Factor (@ 1 GHz): 0.016
• UL rated (94V-0, CTI = 4)
• Compatible with standard and lead-free assembly.
• Laminate thickness available from 0.005” to 0.125”
• Pre-preg thicknesses available (approximate after lamination):
(1080 glass style) 0.0022”
(2116 glass style) 0.0042”
(7628 glass style) 0.0075”
Production Description :
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.