Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

China High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin Supplier
High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin Supplier High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin Supplier

Large Image :  High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE Bh700

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
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Detailed Product Description
Color: Green Material: FR4 Material
Layer: Multilayer Board Size: 11*9cm
Copper Thinknes: 1 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Tin
Name: FR4 Pcb
High Light:

single sided pcb board

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pcb circuit board

High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

 

Quick Detail :
1. Type : Pcb
2. Material : Rogers 
3. Layer : Multilayer
4. Products Size :11*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin   
 
Features:

 

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.

 

Parameter:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2

 

 
Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 
 
Data : 

Layer 1 to 28 layers
Material type FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness 0.21mm to 7.0mm
Copper thickness 0.5 OZ to 7.0 OZ
Copper thickness in hole >25.0 um (>1mil)

 

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

 

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

 

Tolerance

 

Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate UL, ISO 9001, ISO 14001
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

 

 

 

 

Benefits:

•   High Glass Transition Temperature (Tg) (150Tg or 170Tg)

•   High Decomposition Temperature (Td) (> 325º C)

•   Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)

•   Dielectric Constant (@1 GHz): 4.25-4.55

•   Dissipation Factor (@ 1 GHz): 0.016

•    UL rated (94V-0, CTI = 4)

•    Compatible with standard and lead-free assembly.

•   Laminate thickness available from 0.005” to 0.125”

•   Pre-preg thicknesses available (approximate after lamination):

 (1080 glass style) 0.0022”

 (2116 glass style) 0.0042”

 (7628 glass style) 0.0075”

 

 

 

Typical Applications:

  • Phase Array Antennas
  • High Reliability Complex Multilayer Circuits
  • Ground Based and Airborne Radar Systems
  • Commercial Airline Collision Avoidance Systems
  • Global Positioning System Antennas
  • Beam Forming Networks
  •  

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s

 
 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
 

  
 
 
 
 
 
 

 

 

 


 
 
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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