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 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control

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Good quality Multilayer PCB
Good quality Multilayer PCB
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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control

China High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control Supplier
High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control Supplier High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control Supplier High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control Supplier High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control Supplier High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control Supplier

Large Image :  High Speed Multilayer High Frequency PCB HDI Board Fabrication With Impedance Control

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008
Model Number: XCEP

Payment & Shipping Terms:

Minimum Order Quantity: 1pc
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
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Detailed Product Description
Layer: 1-28layer For Mass Production, Up To 40layer Pilot Run Min Hole: 0.15mm
Min Line Widtth: 5um
High Light:

printed circuit board design

,

printed circuit board pcb

HDI pcb, quick turn HDI pcb, blind microvia pcb&laser Microvia filling pcb mfg. Professional PCB FAB. No MOQ. One-stop PCBA. China PCB company. Services: Metal Core PCB Service, Rigid Flex PCB Service, Heavy copper PCB Service, Flexible Circuit Service etc.

 

 

HDI PCB Fr4 High Speed Multilayer Fabrication With Impedance Control


Specification

PCB Type: FR4 PCB
Layer : 4 layer
Min .Line Width/Space: 8milmil/8mil
Min. Via Diameter: 0.3mm
Finish Thickness: 20mil
Surface Finish: ENIG
Size: 3*6MM
Material: KB FR4
Color: green
Application: aviation



High frequency PCB Introduce:
 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2



Parameter

Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating



Description:

FR4 Multi-Layer PCB refer to printed circuit board has more than two copper layers, such as 4L, 6L, 8L, 10L, 12L, etc. As technology improving, people can put more and more copper layers on the same board. Currently, we can produce 20L-32L FR4 PCB.
By this structure, engineer can put trace on different layers for different purpose, such as layers for power, for signal transfering, for EMI shielding, for components assembly, and so on. In order to avoid too many layers, Buried Via or Blind via will be designed in multi-layer PCB. For board more than 8 layers, high Tg FR4 material will be popular than normal Tg FR4.
More layers it is, more complex & difficult the manufacturing will be, and more expensive the cost will be. The lead time of multi-layer PCB is different from normal one, please contact us for accurate leading time.

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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