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Introduction:
High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
Material:
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
FAQ:
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
A:YES
Product Details:
Payment & Shipping Terms:
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| Base Material: | Rogers | Solder Mask: | White |
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| Board THK: | 0.025 Inch | Type: | High Frequency |
| Board Size: | 9*6 Cm | Copper THK: | 1OZ |
| Layer: | 2 | Min Line Space: | 8mil |
| Min Line Width: | 8 Mil | Panel: | 8*2 |
| Origin: | China | Delivery: | DHL,Fedex,TNT Etc. |
| High Light: | electronic pcb board,lead free pcb |
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Rogers RO3210 RF PCB Circuit Boards 0.025inch Thickness Fabricator
Introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal. Look for board performance requirements, can be an ordinary FR4 epoxy glass fiber ,also be Teflon and other special microwave substrates.
RF board standards:
1, low-power RF PCB design, the main use of standard FR4 material (good insulation characteristics , uniform material, a dielectric constant ε = 4,10%).
2, RF of the PCB, the individual elements should be tight arrangement, to ensure that the shortest connection between the various elements.
3, for a PCB mixed-signal, RF and analog section should stay away from digital digital part (this distance is usually more than 2cm, at least 1cm), the digital part of the ground should be separated from the RF part.
4, the choice of working environment in the high frequency components, as far as possible the use of surface-mount devices. This is because the surface-mount components are generally small, the pin element is very short.
Technology:
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Material |
FR4(standard) |
Isola / Nanya / ITEQ |
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FR4(Hi-Tg) |
Isola / Nanya / ITEQ |
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Rogers |
RO4003 /4350 /3010 /RT Duroid 5880 / 5870 |
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Arlon |
Diclad 25N / 25FR / 870 / 880 |
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Taconic |
TLY / TLC / RF35 / RF30 |
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GETEK |
RG200D / ML200D |
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Aluminum PCBs |
Di-electric materials : FR4 / Bergquist / Rogers / Thermagon |
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Copper weight |
1 ~ 5 oz internal & external layers |
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Drilling |
Min. Drilled Hole Size |
10 mil ( 6 ~ 8 mil finished) |
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Annular Ring |
5 mil(normal) / 4 mil (for Laser vias) |
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Registration |
± 3 mil |
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Max. Aspect Ratio |
10 :1 |
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Hole Size Tolerance |
+/- 3 mils (PTH) ; +/- 2 mils (N-PTH) |
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Hole Roughness |
< 0.8 mil |
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Min. Cu Plating in Holes |
> 0.8mil, Ave. 1 mil |
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Laser drill |
available |
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Image Transfer |
Min. Trace and space |
4 / 4 mil |
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SMT / BGA.Pitch |
10 mils for SMT / 30 mils for BGA |
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Trace/space Tolerance |
± 20% (or +/- 10% per IPC class 3) |
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Solder Mask |
LPI Solder Mask |
Green(glossy or matte), Blue, Red, Black, Yellow |
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Via Plugging |
min. 80% filled |
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Solder Mask ink |
Taiyo & Tamura |
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Registration |
± 2 mil |
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Min Solder Dam |
2.5 mil |
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Thickness |
0.5 ~1.5 mil |
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Silkscreen |
White, Yellow, Black |
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Min. silkscreen width |
8 mil |
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CNC Dimension |
± 5 mil |
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Punch Dimension |
± 4 mil |
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Blind Vias / Buried Vias |
Yes |
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VIP (Via in Pad) |
Yes (Non-conductive epoxy resin-filled or Cu filled) |
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Impedance control |
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± 10% |
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Surface Finish |
HASL |
200 ~ 500 μ" |
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Pb free HASL |
100 ~ 500 μ" |
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Immersion Gold |
1 ~ 5 μ" |
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Immersion Silver |
6 ~ 12 μ" |
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Immersion Tin |
25 ~ 40 μ" |
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Electolytic Gold |
Yes |
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Gold Finger Plating |
5 ~ 40 μ" |
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OSP(Entek) |
yes |
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Solder Mask Coating Method |
Silkscreen printing (Double or triple coatings available) |
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Carbon Ink |
20 Ω |
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Peelable mask |
Thickness = 0.3 mm |
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Pumice Pre-treatment |
Available |
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