High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
Payment & Shipping Terms:
|Copper Thinknes:||2 Oz||Min Line Width:||4 Mil|
|Min Line Space:||4mil||Surface Finish:||Immersion Gold Over Nickel, Carbon Print|
|Drill:||Blind & Buried Vias||Original:||China|
Quick Turn Pcb Fabrication,
lead free pcb
High Frequency RF Hybrids Fr4 Pcb Board 1.6 MM Used In Wireless Telecomunication Transceiver
We are the highest efficience pcb manufature here .
(1) Professional Manufacturer on PCB for about 10 years
(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.
(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification
|Surface processing||Lead- Free HASL/Plating gold / immersion gold /Plating gold finger/OSP|
|Board Thickness Range||14~276mil|
|Min Hole Size||3mil|
|Warp & Twist||≦0.7%|
|Min Line Width/Space||2mil /2mil|
|PTH Dia. Tolerance||±2mil|
|NPTH Dia. Tolerance||±1mil|
|Hole Position Deviation||±3mil|
|HDI Capability||Any layer|
a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.
b. Expert circuit board testing, high quality factory wholesale price
c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS
We offer our customers a wide range material and boards:
1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB
2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available
3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)
4. Aluminum PCB board thickness from 0.8mm-3.6mm
5. Quantity from prototype to volume production
6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing
|Board Thickness||1.6 mm|
|Copper Thickness||2 oz|
|Surface Finish||Immersion Gold Over Nickle|
|Min. Trace Width/Spacing||0.075/0.075mm|
|Min. Hole Size||0.25mm|
|Hole Wall Copper Thickness||≥20μm|
|Packaging||Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
|Advantage||Competitive Price,Fast Delivery,OEM&ODM,Free Samples,|
|Special Requirements||Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
|Speciﬁc gravity/density||1.850 g/cm3 (3,118 lb/cu yd)|
|Water absorption||−0.125 in < 0.10%|
|Temperature index||140 °C (284 °F)|
|Thermal conductivity, through-plane||0.29 W/(m·K), 0.343 W/(m·K)|
|Thermal conductivity, in-plane||0.81 W/(m·K), 1.059 W/(m·K)|
|Rockwell hardness||110 M scale|
|Bond strength||> 1,000 kg (2,200 lb)|
|Flexural strength (A; 0.125 in) - LW||> 440 MPa (64,000 psi)|
|Flexural strength (A; 0.125 in) - CW||> 345 MPa (50,000 psi)|
|Tensile strength (0.125 in) LW||> 310 MPa (45,000 psi)|
|Izod impact strength - LW||> 54 J/m (10 ft·lb/in)|
|Izod impact strength - CW||> 44 J/m (8 ft·lb/in)|
|Compressive strength - flatwise||> 415 MPa (60,200 psi)|
|Dielectric breakdown (A)||> 50 kV|
|Dielectric breakdown (D48/50)||> 50 kV|
|Dielectric strength||20 MV/m|
|Relative permittivity (A)||4.8|
|Relative permittivity (D24/23)||4.8|
|Dissipation factor (A)||0.017|
|Dissipation factor (D24/23)||0.018|
|Dielectric constant permittivity||4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz|
|Glass transition temperature||Can vary, but is over 120 °C|
|Young's modulus - LW||3.5×106 psi (24 GPa)|
|Young's modulus - CW||3.0×106 psi (21 GPa)|
|Coefficient of thermal expansion - x-axis||1.4×10−5 K−1|
|Coefficient of thermal expansion - y-axis||1.2×10−5 K−1|
|Coefficient of thermal expansion - z-axis||7.0×10−5 K−1|
|Poisson's ratio - LW||0.136|
|Poisson's ratio - CW||0.118|
|LW sound speed||3602 m/s|
|SW sound speed||3369 m/s|
|LW Acoustic impedance||6.64 MRayl|
Compared Data :
|Model||ER||Tanδ@ 1GHz||Cter (ppm/℃)||
|Park Neclo||N4000-6-FC BC (FR4-HTG)||4.1||0.0015||16|
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.