Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High Frequency RF Hybrids Fr4 Pcb Board In Wireless Telecomunication Transceiver

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  • High Precision FR4 PCB suppliers


High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board

High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.

Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.



(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate

(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss

(3) Consistent with the thermal expansion coefficient of copper

(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.




Q:How to get a PCB prototype quotation?

A:1.PCB Gerber file

2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)

Q:Is your tooling cost one-off payment?





FR4 PCB Sample Introduction

High Frequency RF Hybrids Fr4 Pcb Board In Wireless Telecomunication Transceiver

China High Frequency RF Hybrids Fr4 Pcb Board In Wireless Telecomunication Transceiver Supplier
High Frequency RF Hybrids Fr4 Pcb Board In Wireless Telecomunication Transceiver Supplier High Frequency RF Hybrids Fr4 Pcb Board In Wireless Telecomunication Transceiver Supplier

Large Image :  High Frequency RF Hybrids Fr4 Pcb Board In Wireless Telecomunication Transceiver

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE GR

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
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Detailed Product Description
Color: Green Material: FR4 Material
Layer: Multilayer Board Size: 21*5cm
Copper Thinknes: 2 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Gold Over Nickel, Carbon Print
Drill: Blind & Buried Vias Original: China
Name: FR4 Pcb
High Light:

Quick Turn Pcb Fabrication


lead free pcb

High Frequency RF Hybrids Fr4 Pcb Board 1.6 MM Used In Wireless Telecomunication Transceiver


 Products Details


We are the highest efficience pcb manufature here .



(1) Professional Manufacturer on PCB for about 10 years

(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.

(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification


Feature Parameter (in)
Surface processing Lead- Free HASL/Plating gold / immersion gold /Plating gold finger/OSP
Layers 1~24 layers
Copper Thickness O.5OZ~10OZ
Board Thickness Range 14~276mil
Min Hole Size 3mil
Impedance Control ±5%
Flammability 94V-0
Warp & Twist ≦0.7%
Thermal Shock 5×10Sec@288
Aspect Radio 18:1
Min Line Width/Space 2mil /2mil
PTH Dia. Tolerance ±2mil
NPTH Dia. Tolerance ±1mil
Hole Position Deviation ±3mil
Outline Tolerance ±4mil
S/M Pitch 3mil
HDI Capability Any layer



OME Manufature


a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.

b. Expert circuit board testing, high quality factory wholesale price

c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS


We offer our customers a wide range material and boards:


1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB

2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available

3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)

4. Aluminum PCB board thickness from 0.8mm-3.6mm

5. Quantity from prototype to volume production

6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing






Raw Material Fr4
Layer Count Multilayer 
Board Thickness 1.6 mm
Copper Thickness 2 oz
Surface Finish Immersion Gold Over Nickle 
Solder Mask Green 
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 210*50 mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable



PrePreg Material

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl

 Compared Data : 

  Model ER Tanδ@ 1GHz Cter (ppm/℃)



FR4 Normal 4.6 0.030 17  
FR4 PCL370(FR4-HTG) 4.3 0.0015 51 17
FR4 117 (FR4-HTG) 4.4 0.013   17
Park Neclo N4000-6-FC BC (FR4-HTG) 4.1 0.0015   16

Competitive Advantage:
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.




Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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