Rigid flex PCB have been used in the military and aerospace industries for more than 20 years. In most rigid flex circuit boards, the circuitry consists of multiple flexible circuit inner layers selectively attached together using an epoxy pre-preg bonding film, similar to a multilayer flexible circuit. However, a multilayer rigid flex circuit incorporates a board externally, internally or both as needed to accomplish the design.
Rigid flex PCB combine the best of both rigid boards and flexible circuits integrated together into one circuit. The two-in-one circuit is interconnected through plated thru holes. Rigid flex circuits provide higher component density and better quality control. Designs are rigid where extra support is needed and flexible around corners and areas requiring extra space.
Flex and Rigid-Flex applications also provide increased reliability. Mean time between failure rates (MTBF) typically exceed those of standard PCB sets with discrete wires and connectors, often becoming the choice of companies and engineers alike for its dependable and consistent performance.
Flexible Printed Circuit Boards with 8 layers rigid PCB
Single-Sided Flexible with rigid PCB board up to 6 layer
Double-Sided Flexible Printed Circuit Boards with 4 layer to 12 layer rigid pcb
Multilayer Flexible Printed Circuit Boards with multilayer rigid PCB
Payment & Shipping Terms:
|Base Material:||Rogers 3206||Product Name:||Electronic Pcb/2K*4K Android Quad Core Motherboard/PCB Prototype/Electronic Circuit Board|
|Number Of Layers:||2-Layer||Copper Thickness:||1oz|
|Board Thickness:||Mechanical Drill: 8mil(0.2mm)||Surface Finishing:||HASL/HASL Lead Free/immersion Gold/ENIG|
|Min. Line Width:||0.075mm(3mil)||Min. Line Spacing:||0.1mm(4mil)|
|Min. Hole Size:||0.1mm(4mil)||Rogers High Frequency PCB:||China Rogers Printed Circuit Board|
|Service:||One Stop Turnkey Service||SMT Efficiency:||QFP.SOP.QFN.PLCC.CHIP|
|Testing Service:||X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing||Application:||Telecommunications|
High Frequency multilayer pcb fabrication process With Rogers 3210 Substrate
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.
Rogers pcb material
|PCB production capability|
Gerber, Protel, Powerpcb, Autocad,
FR-4, Hi-Tg FR-4, Lead free Materials
(RoHS Compliant) , CEM-3, CEM-
1, 94V0,Aluminium, High frequency
|Layer No.||1 - 28 Layers|
|Board Thickness Tolerance||±10%|
|Copper thickness||0.5OZ - 4OZ|
|Min Trace Width (a)||0.005"(0.125mm)|
|Min Space Width (b)||0.005"(0.125mm)|
|Min Annular Ring||0.005"(0.125mm)|
|SMD Pitch (a)||0.012"(0.3mm)|
pcb with green solder mask
and LF-FREE surface finishing BGA Pitch (b)
|Min Solder Mask Dam (a)||0.005"(0.125mm)|
|Soldermask Clearance (b)||0.005"(0.125mm)|
|Min SMT Pad spacing (c)||0.004"(0.1mm)|
|Solder Mask Thickness||0.0007"(0.018mm)|
|Hole size||0.01"(0.25mm)-- 0.257"(6.5mm)|
|Hole Size Tol (+/-)||±0.003"(±0.0762mm)|
|Lead free HASL||2.5um|
|Immersion Gold||Nickel 3-7um Au:1-3u''|
|Panel Outline Tol (+/-)||±0.004''(±0.1mm)|
|V-cut||15° 30° 45° 60°|
HAL, HASL Lead Free, Immersion
gold, Gold plating, Gold finger,
immersion silver, immersion Tin,
OSP, Carbon ink,
|Certificate||ROHS ISO9001:2008 TS16949 SGS UL CE|
Buried and blind vias, Impedance
control, via plug, BGA soldering
and gold finger
For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Which widely be used for :
Automotive Antennas / RFID
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Airborne Antenna Systems
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital
|Rogers||RO5880||0.254 0.508 0.762||2.20 ± 0.02|
1. PCB factory directly
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
One stop PCB assembly services Samples in 2-3 days | Bulk orders in 1 week | 2-year warranties Complete OEM assembly performed in-house Handle all customer's needs for PCB assembly,
component purchasing, and other product assemblies
We quote for clients within 3 working days
Testing: PCBA in-circuit testing, PCBA function testing, AOI, X-ray inspection Experience range:
industrial, automotive, computing and storage And consumer, instrumentation, medical, networking, peripherals, telecommunications
Our product range covers various fields, i.e. consumer electronics, telecommunications, industrial products, auto mobile assemblies, medical equipments etc.
Our main services include electronics and metal, casing manufacturing, such as PCB fabrication, component purchasing, PCB assembly, plastic injection molding, high volume metal stamping, die-casting and custom fabrication.
Some Typical Applications:
• Automotive radar applications
• Global positioning satellite
• Cellular telecommunications
systems - power amplifi ers and
• Patch antenna for wireless
• Direct broadcast satellites
• Datalink on cable systems
• Remote meter readers