Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Home SamplesRigid Flex PCB

High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate

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Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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Rigid Flex PCB

  • High Precision Rigid Flex PCB suppliers

Introduction:
Rigid flex PCB have been used in the military and aerospace industries for more than 20 years. In most rigid flex circuit boards, the circuitry consists of multiple flexible circuit inner layers selectively attached together using an epoxy pre-preg bonding film, similar to a multilayer flexible circuit. However, a multilayer rigid flex circuit incorporates a board externally, internally or both as needed to accomplish the design.


Rigid flex PCB combine the best of both rigid boards and flexible circuits integrated together into one circuit. The two-in-one circuit is interconnected through plated thru holes. Rigid flex circuits provide higher component density and better quality control. Designs are rigid where extra support is needed and flexible around corners and areas requiring extra space.


Flex and Rigid-Flex applications also provide increased reliability. Mean time between failure rates (MTBF) typically exceed those of standard PCB sets with discrete wires and connectors, often becoming the choice of companies and engineers alike for its dependable and consistent performance.

 

 

Types:
Flexible Printed Circuit Boards with 8 layers rigid PCB
Single-Sided Flexible with rigid PCB board up to 6 layer
Double-Sided Flexible Printed Circuit Boards with 4 layer to 12 layer rigid pcb
Multilayer Flexible Printed Circuit Boards with multilayer rigid PCB

Rigid Flex PCB Sample Introduction

High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate

China High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate Supplier
High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate Supplier High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate Supplier

Large Image :  High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: ISO9001/TS16949/IPC/ROHS/UL
Model Number: XCER

Payment & Shipping Terms:

Minimum Order Quantity: 1piece
Price: USD 10-100 Pieces
Packaging Details: inner:vacuum-packed bubble bag outer: carton box
Delivery Time: 5-8 work days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10000000Piece/Pieces per Month
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Detailed Product Description
Base Material: Rogers 3206 Product Name: Electronic Pcb/2K*4K Android Quad Core Motherboard/PCB Prototype/Electronic Circuit Board
Number Of Layers: 2-Layer Copper Thickness: 1oz
Board Thickness: Mechanical Drill: 8mil(0.2mm) Surface Finishing: HASL/HASL Lead Free/immersion Gold/ENIG
Min. Line Width: 0.075mm(3mil) Min. Line Spacing: 0.1mm(4mil)
Min. Hole Size: 0.1mm(4mil) Rogers High Frequency PCB: China Rogers Printed Circuit Board
Service: One Stop Turnkey Service SMT Efficiency: QFP.SOP.QFN.PLCC.CHIP
Testing Service: X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing Application: Telecommunications
High Light:

custom-made pcb

,

custom pcb

 

High Frequency multilayer pcb fabrication process With Rogers 3210 Substrate

 
 
 
Detailed Product Description
Rogers 3210 High frequency Laminate in stock
Model: XCEH Origin: Shenzhen
Size: 8*9cm Layer 2
Brand: XCE Color: Green
 

 

 

Specification

  • 2 layer
  • Green solder mask, 
  • Model:XCER
  • Copper THK: 1OZ
  • Location: Shenzhen

 

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.

 

Rogers pcb material

 

PCB production capability
Files

Gerber, Protel, Powerpcb, Autocad, 

Orcad, Eagle,etc.

Material

FR-4, Hi-Tg FR-4, Lead free Materials 

(RoHS Compliant) , CEM-3, CEM-

1, 94V0,Aluminium, High frequency 

Material (Rogers, 

Teflon, Taconic)

Layer No. 1 - 28 Layers
Board thickness 0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance ±10%
Copper thickness 0.5OZ - 4OZ
Impedance Control ±10%
Warpage 0.075%-1.5%
Peelable 0.012"(0.3mm)-0.02’(0.5mm)
Min Trace Width (a) 0.005"(0.125mm)
Min Space Width (b) 0.005"(0.125mm)
Min Annular Ring 0.005"(0.125mm)
SMD Pitch (a) 0.012"(0.3mm)

pcb with green solder mask 

and LF-FREE surface finishing BGA Pitch (b)

0.027"(0.675mm)
Regesiter torlerance 0.05mm
Min Solder Mask Dam (a) 0.005"(0.125mm)
Soldermask Clearance (b) 0.005"(0.125mm)
Min SMT Pad spacing (c) 0.004"(0.1mm)
Solder Mask Thickness 0.0007"(0.018mm)
Hole size 0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-) ±0.003"(±0.0762mm)
Aspect Ratio 6:01
Hole Registration 0.004"(0.1mm)
HASL 2.5um
Lead free HASL 2.5um
Immersion Gold Nickel  3-7um  Au:1-3u''
OSP 0.2-0.5um
Panel Outline Tol (+/-) ±0.004''(±0.1mm)
Beveling 30°45°
V-cut 15° 30° 45° 60°
Surface finish

HAL, HASL Lead Free, Immersion 

gold, Gold plating, Gold finger,

 immersion silver, immersion Tin, 

OSP, Carbon ink,

Certificate  ROHS  ISO9001:2008  TS16949  SGS  UL  CE
Special requirements

Buried and blind vias, Impedance 

control, via plug, BGA soldering 

and gold finger

 

Materials used for HF circuit boards

 

For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

 

Which widely be used for :

Automotive Antennas / RFID

Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability

Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital

 

 

High frequency:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254    0.508  0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2
 

 

 

Advantage

 

1. PCB factory directly

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours

5. PCB certification(ISO/UL E354810/RoHS)

6. 12 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

 

One stop PCB assembly services Samples in 2-3 days | Bulk orders in 1 week | 2-year warranties Complete OEM assembly performed in-house Handle all customer's needs for PCB assembly,

component purchasing, and other product assemblies 
We quote for clients within 3 working days 

Testing: PCBA in-circuit testing, PCBA function testing, AOI, X-ray inspection Experience range:

industrial, automotive, computing and storage And consumer, instrumentation, medical, networking, peripherals, telecommunications

 

Our product range covers various fields, i.e. consumer electronics, telecommunications, industrial products, auto mobile assemblies, medical equipments etc.
  
Our main services include electronics and metal, casing manufacturing, such as PCB fabrication, component purchasing, PCB assembly, plastic injection molding, high volume metal stamping, die-casting and custom fabrication.
 

 

 

Some Typical Applications:
• Automotive radar applications
• Global positioning satellite
antennas
• Cellular telecommunications
systems - power amplifi ers and
antennas
• Patch antenna for wireless
communications
• Direct broadcast satellites
• Datalink on cable systems
• Remote meter readers

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)