Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High frequency hasl bare pcb Board For Electronics , FR - 4 / High TG / Rogers Material

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Good quality Multilayer PCB
Good quality Multilayer PCB
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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

High frequency hasl bare pcb Board For Electronics , FR - 4 / High TG / Rogers Material

China High frequency hasl bare pcb Board For Electronics , FR - 4 / High TG / Rogers Material Supplier
High frequency hasl bare pcb Board For Electronics , FR - 4 / High TG / Rogers Material Supplier High frequency hasl bare pcb Board For Electronics , FR - 4 / High TG / Rogers Material Supplier

Large Image :  High frequency hasl bare pcb Board For Electronics , FR - 4 / High TG / Rogers Material

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCED

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 1
Color: Green Min Line Space: 8mil
Min Line Width: 8mil Copper Thickness: 1OZ
Size: 12*8cm Board THK: 1.8MM
Panel: 1*1 Surface Finish: HASL
Model: XCES Brand: XCE
High Light:

single sided pcb board

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pcb circuit board

 

High frequency hasl bare pcb Board For Electronics , FR - 4 / High TG / Rogers Material

 

 

Description

 

1. Specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 

 

Parameter:

 

Layer

1 to 28 layers

Material type

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

Board thickness

0.21mm to 7.0mm

Copper thickness

0.5 OZ to 7.0 OZ

Copper thickness in hole

>25.0 um (>1mil)

 

Size

Max. Board Size: 23 × 25 (580mm×900mm)

Min. Drilled Hole Size: 3mil (0.075mm)

Min. Line Width: 3mil (0.075mm)

Min. Line Spacing: 3mil (0.075mm)

 

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating 

 

Tolerance

 

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076              NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

 
 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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