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Heavy Copper PCB

Introduction:
Heavy Copper PCB are printed circuit boards with 3 or more ounces of finished copper in the inner and/or outer layers.
While there is no standard definition of Heavy Copper, it is generally accepted that if 3 ounces (oz) of copper or more is used on the internal and external layers of a printed circuit board, it is called a heavy copper PCB. Any circuit with a copper thickness of more than 4 oz per square foot (ft2) is also categorized as a heavy copper PCB. Extreme copper means 20 oz per ft2 to 200 oz per ft2.

When the electronic device need high power or current through, Then we need consider heave copper to control the thermal on PCB

The benefits of heavy copper in PCBs:
Reduction of thermal strain
Better current conductivity
Can survive repeated thermal cycling
Smaller PCB size due to layering of copper
Increased connector site strength

Heavy Copper PCB Sample Introduction

High Frequency Double Sided PCB Teflon Pcb Boards In Filters Combiners RF

Large Image : High Frequency Double Sided PCB Teflon Pcb Boards In Filters Combiners RF

Product Details:

Place of Origin:	China
Brand Name:	XCE
Certification:	CE,ROHS,FCC,ISO9008,SGS,UL
Model Number:	XCE Bh78

Payment & Shipping Terms:

Minimum Order Quantity:	MOQ 1 Piece
Price:	Negotiation
Packaging Details:	1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time:	5-10 working days
Payment Terms:	T/T, Western Union
Supply Ability:	1000000 pieces per week

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Detailed Product Description

Color:	Blue	Material:	Rogers+FR4 Material
Layer:	2	Board Size:	11*5cm
Copper Thinknes:	1 Oz	Min Line Width:	4 Mil
Min Line Space:	4mil	Surface Finish:	Immersion Gold
Name:	Pcb
High Light:	double sided pcb board , double side pcb

High Frequency Double Sided PCB Teflon Pcb Boards In Filters Combiners RF

Quick Detail :
1. Type : Pcb
2. Material : Rogers+FR4
3. Layer : 2
4. Products Size :11*5cm
5. Permittivity : 2.5
6. Surface finish : Immersion Gold

Features:

RT/duroid® high frequency laminates are PTFE composites reinforced with glass microfibers.The randomly oriented microfibers result in exceptional dielectric constant uniformity.

The dielectric constant of these high frequency laminates is the lowest of all products, and low dielectric loss make them well suited for high frequency/ broad band applications where dispersion and losses need to be minimized. Because of its extremely low water absorption characteristics, RT/duroid 5880 laminates are ideal for applications in high moisture environments.

RT/duroid laminates are easily cut, sheared and machined to shape, and resistant to all solvents and reagents normally used in etching printed circuits or plating edges and holes. RT/duroid 5870 and 5880 laminates have the lowest electrical loss of any reinforced PTFE material, low moisture absorption, are isotropic, and have uniform electrical properties over frequency.

Parameter:

Model	Parameter	thickness(mm)	Permittivity(ER)
F4B	F4B	0.38	2.2
	F4B	0.55	2.23
	F4B	0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0	2.65
	F4Bk	0.8,1.5	2.65
	F4B	0.8	3.5
	FE=F4BM	1	2.2
Rogers	RO5880	0.254 0.508 0.762	2.20 ± 0.02
	RO4350	0.254 0.508,0.8,1.524	3.5
	RO4003	0.508	3.38
TACONIC	TLF-35	0.8	3.5
	TLA-6	0.254,0.8,1,1.5,	2.65
	TLX-8	0.254,0.8,1,1.6	2.55
	RF-60A	0.64	6.15
	TLY-5	0.254,0.508,0.8	2.2
	TLC-32	0.8,1.5,3	3.2
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2

Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

4.RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

Data :

Layer	1 to 28 layers
Material type	FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness	0.21mm to 7.0mm
Copper thickness	0.5 OZ to 7.0 OZ
Copper thickness in hole	>25.0 um (>1mil)
Size	Max. Board Size: 23 × 25 (580mm×900mm)
	Min. Drilled Hole Size: 3mil (0.075mm)
	Min. Line Width: 3mil (0.075mm)
	Min. Line Spacing: 3mil (0.075mm)
Surface finishing	HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Tolerance	Shape tolerance: ±0.13
Tolerance	Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate	UL, ISO 9001, ISO 14001
Special requirements	Buried and blind vias+controlled impedance +BGA
Profiling	Punching, Routing, V-CUT, Beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

Benefits:

Low loss for excellent high frequency performance
Tight εr and thickness control
Excellent electrical and mechanical properties
Extremely low thermal coeffi cient of dielectric constant
In-plane expansion coeffi cient matched to copper
Low Z-axis expansion
Low outgassing; Ideal for space applications

Typical Applications:

commercial airline broadband antennas
microstrip and stripline circuits
millimeter wave applications
military radar systems
missile guidance systems
point-to-point digital radio antennas

Production Description :

Parameter	Value
Speciﬁc gravity/density	1.850 g/cm³ (3,118 lb/cu yd)
Water absorption	−0.125 in < 0.10%
Temperature index	140 °C (284 °F)
Thermal conductivity, through-plane	0.29 W/(m·K),^[1] 0.343 W/(m·K)^[2]
Thermal conductivity, in-plane	0.81 W/(m·K),^[1] 1.059 W/(m·K)^[2]
Rockwell hardness	110 M scale
Bond strength	> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW	> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW	> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW	> 310 MPa (45,000 psi)
Izod impact strength - LW	> 54 J/m (10 ft·lb/in)
Izod impact strength - CW	> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise	> 415 MPa (60,200 psi)
Dielectric breakdown (A)	> 50 kV
Dielectric breakdown (D48/50)	> 50 kV
Dielectric strength	20 MV/m
Relative permittivity (A)	4.8
Relative permittivity (D24/23)	4.8
Dissipation factor (A)	0.017
Dissipation factor (D24/23)	0.018
Dielectric constant permittivity	4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature	Can vary, but is over 120 °C
Young's modulus - LW	3.5×10⁶ psi (24 GPa)
Young's modulus - CW	3.0×10⁶ psi (21 GPa)
Coefficient of thermal expansion - x-axis	1.4×10⁻⁵ K⁻¹
Coefficient of thermal expansion - y-axis	1.2×10⁻⁵ K⁻¹
Coefficient of thermal expansion - z-axis	7.0×10⁻⁵ K⁻¹
Poisson's ratio - LW	0.136
Poisson's ratio - CW	0.118
LW sound speed	3602 m/s
SW sound speed	3369 m/s

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Tag:

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946