Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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Rogers PCB

  • High Precision Rogers PCB suppliers

Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.


Sufficient stock:

We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Rogers PCB Sample Introduction

HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via

China HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via Supplier
HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via Supplier HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via Supplier

Large Image :  HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE BK

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
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Detailed Product Description
Color: Yellow Material: FR4 Material
Layer: 4 Board Size: 53*61cm
Copper Thinknes: 1 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Silver
Name: FR4 Pcb
High Light:

pcb manufacturing process


fr4 circuit board

HF High 150 TG FR4 Material With 3 mm Blind Buried Hole Via

Products Details


We are the highest efficience pcb manufature here .



(1) Professional Manufacturer on PCB for about 10 years

(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.

(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification




OME Manufature


a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.

b. Expert circuit board testing, high quality factory wholesale price

c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS


We offer our customers a wide range material and boards:


1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB

2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available

3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)

4. Aluminum PCB board thickness from 0.8mm-3.6mm

5. Quantity from prototype to volume production

6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing




PrePreg Material

Parameter Standard Spec (mm)
Layer 4 L
DHI stack 3
Board thinckness 3.0
Max work panel size 530×610
Aspect ratio 12:1
L/S 0.07/0.07
Surfce finish OPS,ENIG,Hard gold
Material FR-4
Inner packaging Vacuum
Solder masker Green/ Black/ Red/ Yellow/ White/Blue
Outgoing reports Final inspection,solderability test,micro section test ,thermal stresses test and more


Performance characteristics
Glass Transition Temperature (Tg) 150Tg or 170Tg
Decomposition Temperature (Td) > 325℃
Coefficient of Thermal Expansion (CTE) 3.0%-3.8%
Dielectric Constant (@1 GHz) 4.25-4.55
Dielectric Constant (@55 GHz) ≤5.5
Dissipation Factor (@ 1 GHz) 0.016
Water imbibition (D - 24/23, the thickness of 1.6 mm) ≤19mg
Laminate thickness 0.005”~ 0.125”
Combustibility FV0
Density 1.70-1.90g/cm&sup3
Vertical Layer To The Bending Strength A Normal :E-1/150,150±5℃≥340Mpa
Parallel To The Floor To The Impact Strength (beam) ≥233KJ/m
Execution Standard GB/T1303.1-1998
After Flooding Insulation Resistance D-24/23):≥5.0×108Ω
Vertical layer to the electric strength (in the middle of 90 + 2 ℃ for transformer oil, thickness 1 mm) ≥14.2MV/m
Parallel layer to the breakdown voltage (90 + 2 ℃ in the transformer oil) ≥40KV


Competitive Advantage:
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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