Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner

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Good quality Multilayer PCB
Good quality Multilayer PCB
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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner

China HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier
HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner Supplier

Large Image :  HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008
Model Number: XCER-3

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Base Material: FR4 Board Thickness: 1.6mm
Surface Finish: Immersion Gold Layer: 24
Soldermask: Green Silkscreen: White
High Light:

printed circuit board design

,

printed circuit board pcb

HDI High TG 24 multilayer immerison gold Inner 0.5oz outer 1oz PCB board

 

Material:FR4 Soldermask:Green
Molde Number:xcepcb0011 Silkscreen:White
Layer:24 Panel Size:75*105mm
Board Thickness:1.6mm

Package Details:

Inner:Vacuum-packed

Bubble bag

With Foam

Outer:Carton Box

Min Line Space:4Mil
Min Line Width:4Mil
Min Hole Size:12Mil
Finished Surface:ENIG

Special requirement:

Provide Slice report

Provide shipment report

Finished Copper:1oz
Delivery Time:8 Days

 

Parameter

 

Profile tolerance ±0.10mm(4mil)c
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 

Laminate
Technology Index Mass production Middle and Small Volume Prototype
FR4 Normal Tg S1141 (Not Recommander for HF )
Middle Tg S1000H(HDI, Mul-layer Board))
High Tg S1000-2M, IT180A(Heavy Copper, Multi-Layer Board)
Halogen Free Middle Tg S1150g
High Tg s1165
Ceramics Filled High Frequency Board Rogers series,Arlon Series,Toconic Series,Taizhou Lin Wang
Special PP Low Flow PP, Arlon 49N
Ceramic Filled, Rogers4450, Arlon25FR
PTFE PP, Arlon 6700,Taconic FR-27
Rigid PI Arlon 85N,Shenyi SH260
Metal-Substrate Bercquist AL Substrate, Copper Substrate
Pure Ceramics Material N/A
Note: For other material not involed, We can purchase or help to purchase for customers special requirements.

 

Technology Index Mass production Middle and Small Volume Prototype
Layer FR4 Series 20 28 36
Rigid Flex/Flex 6(4) 10(8) 16(12)
High Frequency Hibrid Laminate 12 18 24
Pure PEFE 4 8 12
Metal Core 2 4 4

 

 

Some more case:

 

HDI Board Thickness Fr4 Printed Circuit Boar OSP HDI High TG 24 Multilayer Immerison Gold Inner

About us:

 

Xinchenger, have commited to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station.

 

Our advantage:


1,The industry’s top materials business High TG, FR4, high frequency(Rogers,Teflon, ARLON, TYCONIC),Long-term cooperation.

2,Advanced technology


min/T/G:3/3 mil
min CMC hole: 0.15mm
min line width: 5um(3um available)
MAX aspect ratio for board thickness vs drill bit size 15:1

 

3,Our unique one stop solution to all printed circuit needs, PCB &PCBA assembly service and component procument

 

4,Quality control:

AOI Testing

X-Ray Inspection

In-Circuit Testing

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)