Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Half Hole HDI Fr4 pcb circuit board Immersion Silver Surface Rogers

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

Half Hole HDI Fr4 pcb circuit board Immersion Silver Surface Rogers

China Half Hole HDI Fr4 pcb circuit board Immersion Silver Surface Rogers Supplier
Half Hole HDI Fr4 pcb circuit board Immersion Silver Surface Rogers Supplier Half Hole HDI Fr4 pcb circuit board Immersion Silver Surface Rogers Supplier

Large Image :  Half Hole HDI Fr4 pcb circuit board Immersion Silver Surface Rogers

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: Fr4 XCE-2

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
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Detailed Product Description
Color: Green Material: Fr4+rogers
Layer: 4 Board Size: 8*6cm
Copper Thinknes: 1 Oz Min Line Width: 5 Mil
Min Line Space: 5 Mil Surface Finish: Immersion Gold
Name: Fr4 Pcb
High Light:

single sided pcb board

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pcb circuit board

Half Hole DHI Fr4 Single Sided Pcb Immersion Silver Surface Rogers Pcb Multilayer Circuit Board

 

Quick Detail :

1. Type : Pcb

2. Material : Fr4+rogers

3. Layer : Single Sided

4. Products Size : 8*6 cm

5. Permittivity : 10.2

6. Surface finish : Immersion Gold

 

Features:

1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .

2. Immersion gold surface finish make the pcb 's conductive performance enhancements.

3. Multilayer pcb design ,the precision of the pcb improves much more better .

4. Low dielectric : 10.2 dielectric conductivity much more precision .

 

 

Description :

Low dielectric high-frequency multilayer rogers pcb ,improve the fr4 custom pcb 's conductivity and the high quality make the customer save more costs .

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

 

 

Production Description :

XCE PCB technical specifications
Annual stock Material Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No. 1~16
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size 508*610mm
Board thickness tolerance T0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp 0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 28820Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 

 

Competitive Advantage:

1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

 

 

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

  

 

 

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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