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 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Green FR4 Single Sided PCB Circuit Boards For Audio Amplifier Single Layer 1.6mm

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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

Green FR4 Single Sided PCB Circuit Boards For Audio Amplifier Single Layer 1.6mm

China Green FR4 Single Sided PCB Circuit Boards For Audio Amplifier Single Layer 1.6mm Supplier
Green FR4 Single Sided PCB Circuit Boards For Audio Amplifier Single Layer 1.6mm Supplier Green FR4 Single Sided PCB Circuit Boards For Audio Amplifier Single Layer 1.6mm Supplier

Large Image :  Green FR4 Single Sided PCB Circuit Boards For Audio Amplifier Single Layer 1.6mm

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCES

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Min Line Space: 0.2mm Min Line Width: 0.2mm
Copper Thickness: 1OZ Size: 6*5cm
Board THK: 1.6MM Panel: 5*1
Surface Finish: ENIG Color: Green
Material: FR4 Model: XCES
High Light:

single sided pcb board

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pcb circuit board

Green FR4 Single Sided PCB Circuit Boards For Audio Amplifier 

 

 

Specification:

 

 Layer: 1 Layer

 Material: FR4

 Thickness: 1.6mm

 Copper thickness: 1oz

 Mini Hole: 0.2mm

 Mini Width/space: 0.2mm/0.2mm

 Testing points:4000

 Solder Mask: LPI Green

 Sickscreen: White

 Function:Medical equipment

 Finish:HASL leadfree

 

 

Parameter:

 

PCB parameter
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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