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Introduction:
Heavy Copper PCB are printed circuit boards with 3 or more ounces of finished copper in the inner and/or outer layers.
While there is no standard definition of Heavy Copper, it is generally accepted that if 3 ounces (oz) of copper or more is used on the internal and external layers of a printed circuit board, it is called a heavy copper PCB. Any circuit with a copper thickness of more than 4 oz per square foot (ft2) is also categorized as a heavy copper PCB. Extreme copper means 20 oz per ft2 to 200 oz per ft2.
When the electronic device need high power or current through, Then we need consider heave copper to control the thermal on PCB
The benefits of heavy copper in PCBs:
Reduction of thermal strain
Better current conductivity
Can survive repeated thermal cycling
Smaller PCB size due to layering of copper
Increased connector site strength
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 | Layer: | 4 |
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| Color: | Green | Min Line Space: | 8mil |
| Min Line Width: | 8mil | Copper Thickness: | 105um |
| Size: | 2*3cm | Board THK: | 0.8MM |
| Panel: | 7*6 | Surface Finish: | Immersion Silver |
| Model: | XCED | Brand: | XCE |
| High Light: | double sided board,double side pcb |
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4 Layer Double Sided Prototype PCB Fabrication For Elevator / Moving Staircase
Description
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Parameter:
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Layer |
1 to 28 layers |
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Material type |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
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Board thickness |
0.21mm to 7.0mm |
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Copper thickness |
0.5 OZ to 7.0 OZ |
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Copper thickness in hole |
>25.0 um (>1mil) |
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Size |
Max. Board Size: 23 × 25 (580mm×900mm) |
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Min. Drilled Hole Size: 3mil (0.075mm) |
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Min. Line Width: 3mil (0.075mm) |
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Min. Line Spacing: 3mil (0.075mm) |
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Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
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Tolerance
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Shape tolerance: ±0.13 |
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Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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Certificate |
UL, ISO 9001, ISO 14001 |
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Special requirements |
Buried and blind vias+controlled impedance +BGA |
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Profiling |
Punching, Routing, V-CUT, Beveling |
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Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. |
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